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XQuik V is for fast, accurate X-ray-based component counting and inventory control. High-resolution X-ray imaging with enhanced source power. Automatic load drawer for simplified operation. Integrated barcode camera links reel IDs to count data. Designed to reduce manual entry errors, improve material accuracy, and speed inventory verification.

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Summit LT150 is for rework of large, high-density electronic assemblies and next-generation components. Supports components up to 150mm. Large field-of-view vision system with full-component visibility. Scaled top and bottom heating with dual PID control. Supports board sizes up to 24×36in, with optional larger formats. Increased clearance for tall connectors, heat sinks, and power modules. Designed to maintain uniform thermal performance while reducing thermal stress.

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Photonics Systems InnoLas DP10X0 laser depaneling system is specifically designed for PCB assembly operations.

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Flip Chips with Daisy Chain dummy components are for developing electrical test expertise.

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Keiron LiFT printer offers stencil-free paste application for component assembly.

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Master Bond’s Supreme 10HTLV is a one-part, heat-cured epoxy. The non-frozen system features a moderately high viscosity with good flow characteristics and does not thicken over time. Supreme 10HTLV offers unlimited working life at room temperature and requires no mixing. The epoxy delivers high mechanical strength, achieving tensile shear strengths exceeding 3,600psi and T-peel strengths up to 30pli. The system withstands cryogenic temperatures down to 4K and remains serviceable up to 400°F. Survives 1,000 hours at 85°C/85% relative humidity. The epoxy also resists water, oils and a wide range of chemicals. Supreme 10HTLV is electrically insulative, with a volume resistivity greater than 10¹²ohm-cm at room temperature, and bonds effectively to metals, glass, ceramics and many plastics. It offers flexible heat-curing profiles, including 60–75 minutes at 250°F or 35–40 minutes at 300°F.

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