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New Products

Molex has released the Quad-Row Shield Connector, a board-to-board interface that incorporates an integrated metal EMI shield within a four-row signal structure. Uses an internal shielding element to limit electromagnetic and RF interference without external shielding components. The design supports up to 80 signal pins with two power-pin sets. It retains the company’s quad-row layout while adding EMI control at 2.4–6GHz. The connector is intended for compact devices such as wearables, mobile systems, AR and VR units, and other consumer hardware requiring space-efficient board-to-board connections.

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Stackpole Electronics HCSK1216 high current four terminal shunt resistor separates supply current and voltage sensing paths, minimizing power loss and eliminating lead resistance errors.

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Essemtec Tarantula Dual Lane dispensing platform supports up to three valve heads, and Jet-on-the-Fly achieves up to 1.1 million dph at maximum frequency, and an average of 350,000 dph for complex boards in high-speed paste jetting or 2 million dph for glue jetting applications.

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Vision Engineering ProteQ VISO 3-D digital stereo microscope features fully integrated autostereo display.

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Shenmao PF606-P279L ultra-fine pitch solder paste is for mini-LED manufacturing.

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Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.

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