New Products
ASMPT Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution.
Mycronic MYPro A41DX and A41SX placement machines handle boards up to 1,000mm x 609mm in size, 12.5mm thick and up to 10kg using new T1000 conveyor.
Mycronic BA 01 small dot ejector for MY700 jet printer accommodates solder paste deposits from 180 to 330µm in diameter with a volume ranging from 1 to 4nl.
Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates.
ASYS VEGO GenS handler has modular design and up to 20% faster cycle time than previous models.
Press Releases
- Scanfil and Valmet to Strengthen Their Business Relationship in Electronics Manufacturing Services
- KIC Relocates Global Headquarters to New San Diego Facility
- Nihon Superior Co. Ltd. Mourns the Passing of Keith Howell
- Mobius Materials Raises $3M to Combat One of Manufacturing’s Biggest Issues Amid US-China Trade Tariffs