Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.

Solderstar WaveShuttle O₂ verification tool. Builds on the original WaveShuttle by adding real-time oxygen measurement to wave soldering process control. Captures seven parameters in a pass, including temperature profile, wave contact, wave height, line speed, inclination angle, vibration and oxygen concentration. Features titanium contact sensors for wave height and line speed measurement, plus a three-axis vibration sensor that detects mechanical instability caused by worn parts or misaligned tooling. Inclination sensors track PCB entry and exit angles at the wave. ESD composite and titanium construction, with custom production sizes available. Integrates with SLX datalogger to separate machine-level variation from PCB-specific issues.

Hirose DF22 Series of power connectors now comes with DF22B branch adapter, designed to simplify wiring and reduce cabling and installation time. Enables branch wiring and supports up to 30A per contact at 1000V AC/DC with a four-point contact design and highly conductive materials. Offers multiple configurations, straight, right-angle, and in-line wire-to-board, with three housing types featuring different guide keys and color variations to prevent mis-mating in systems using multiple connectors. For harsh environments, a straight header variant supports potting up to 10mm. Is for compact, high-current branching applications such as semiconductor equipment, industrial robots, conveyors, mounting machines and service robots.

Henkel has introduced Loctite TCF 14001, a high thermal conductivity silicone liquid TIM designed to meet the thermal control requirements of 800G and 1.6T optical transceivers. A thermal conductivity of 14.5 W/m-K. The two-part silicone formulation features low volatility and minimal outgassing. Its filler technology allows for automated dispensing with stable flow, strong adhesion and tolerance for gap variations. Beyond AI data centers, Loctite TCF 14001 is also suitable for other high-power applications in telecom, automotive, power generation and industrial automation.