Workbench configurator platform supports design and visualization of modular workstation environments using Treston and IAC solutions. Enables users to configure workbenches, storage systems and accessories through an interactive interface with real-time layout adjustments. Supports selection of standard and custom configurations to align with production requirements and facility constraints. Provides visualization tools to compare layouts and assess integration into existing manufacturing lines. Designed to streamline workstation planning, reduce design time and support coordination across engineering, production and procurement teams.
Cumberland Electronics Strategic Supply Solutions
Omnyx PCBA test platform supports detection of structural, parametric, high-speed interconnect and functional defects in printed circuit board assemblies used in AI servers and data center systems. Combines synchronized analog and digital subsystems with mission-mode and software-directed testing to identify at-speed and operational defects earlier in the manufacturing process. Supports single-site, multi-site and large-format test architectures with pin capacity from 2,560 to more than 10,000 pins. Accommodates PCB sizes up to 900×750mm and weights up to 15kg. Includes no-touch high-speed conveyance with SMEMA compatibility and supports automated or manual fixture configurations. Designed to improve yield, product quality and test coverage in high-performance computing hardware production.
EHS-222M-L highly accelerated stress test chamber supports reliability testing of large multilayer PCBs and high-density electronic assemblies. Accommodates board sizes up to 290×460mm with increased internal depth and expanded fixture capacity for high specimen volumes. Provides up to 120 bias terminals at up to 1,000V to support complex testing configurations. Operates across temperature range of +105.0°C to +142.9°C, humidity range of 75%–100%RH and pressure range of 0.019–0.193MPa. Supports accelerated reliability testing for AI hardware, automotive electronics and data center systems requiring high-temperature, high-humidity and pressure conditions.
The Mydata Midas tool 2026-5652 supports placement of the N61381US component in SMT assembly processes. The tool features a 0.125" outside diameter and 0.047" inside diameter with a 90° V-cut profile designed to align and seat components during placement. It is pinned to D121 to maintain alignment and positioning consistency during pick-and-place operations. The geometry supports stable handling of specialized components and consistent vacuum performance for automated assembly environments. The tool is designed for use on MYDATA systems and supports applications requiring precise component placement and handling of non-standard geometries.
Boardera API PCB project analyzer automates fabrication analysis, BOM processing, assembly planning and project pricing for electronics manufacturing workflows. The system extracts fabrication requirements including layer stackup, board dimensions, copper area, drill data and pad features from design files. BOM tools map component data, generate procurement links, assess availability and end-of-life risk and flag compliance with RoHS and REACH. Assembly planning functions calculate part counts, placement volumes, and package classifications to support process planning. Pricing modules support PCB-only, assembly-only, and turnkey configurations with models aligned to fabrication and EMS operations. The API integrates into manufacturer systems to support design analysis, quoting and production planning across PCB fabricators, assemblers and OEMs.
Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.