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New Products

Stackpole Electronics HCSK1216 high current four terminal shunt resistor separates supply current and voltage sensing paths, minimizing power loss and eliminating lead resistance errors.

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Essemtec Tarantula Dual Lane dispensing platform supports up to three valve heads, and Jet-on-the-Fly achieves up to 1.1 million dph at maximum frequency, and an average of 350,000 dph for complex boards in high-speed paste jetting or 2 million dph for glue jetting applications.

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Vision Engineering ProteQ VISO 3-D digital stereo microscope features fully integrated autostereo display.

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Shenmao PF606-P279L ultra-fine pitch solder paste is for mini-LED manufacturing.

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Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.

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Solderstar WaveShuttle O₂ verification tool. Builds on the original WaveShuttle by adding real-time oxygen measurement to wave soldering process control. Captures seven parameters in a pass, including temperature profile, wave contact, wave height, line speed, inclination angle, vibration and oxygen concentration. Features titanium contact sensors for wave height and line speed measurement, plus a three-axis vibration sensor that detects mechanical instability caused by worn parts or misaligned tooling. Inclination sensors track PCB entry and exit angles at the wave. ESD composite and titanium construction, with custom production sizes available. Integrates with SLX datalogger to separate machine-level variation from PCB-specific issues.

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