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New Products

Vishay Intertechnology has released four new power inductors in 0806 and 1210 case sizes, expanding its IHLL (commercial grade) and IHLP (AEC-Q200 automotive grade) portfolios. The IHLL-0806AZ-1Z and IHLL-1210AB-1Z, along with the automotive-qualified IHLP-0806AB-5A and IHLP-1210ABEZ-5A, support inductance values from 0.22µH to 4.70µH with typical DCR as low as 6.6mΩ. The devices operate up to +165°C. The inductors use a composite powdered-iron construction that fully encapsulates the windings. Automotive versions feature side-plated terminations to support solder fillets and inspection, while commercial versions use bottom-only terminations.

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Adaptsys Group has released 3DInspect, an automated system for inspecting carrier tape pockets and generating Certificates of Conformance (CoCs). 3DInspect measures carrier tape dimensions and produces inspection reports automatically, reducing inspection time per reel from up to 30 minutes to about one minute. The system replaces manual inspection and documentation. The system can be used as a standalone inspection tool or integrated into tape-and-reel operations. 

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Count On Tools’ new custom large-format vacuum nozzle is designed for Yamaha YRM pick-and-place platforms for handling stability and pickup reliability for larger and heavier SMT components used in high-mix production environments. Features a 25mm base diameter to increase surface contact during vacuum pickup and is precision-machined to fit ANE locations 64, 66, and 68. includes a 15.0mm O-ring. 

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The i-CON TRACE soldering station provides traceability, IoT connectivity and IPC CFX certification for hand soldering operations. The system captures process data to support quality documentation, compliance requirements and connected factory integration.

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The heating head for the HR 600 XL supports controlled rework of large-format and high-density assemblies. Designed for BGAs, QFNs, connectors and complex components, the heating head integrates with vision alignment and process control for repeatable thermal profiles.

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The VERSAFLEX 2.0 solder module enables independent, parallel processing of two PCBs within a single selective soldering system. Supports automatic nozzle changing and matrix-controlled preheating to improve throughput, setup consistency and repeatability in high-mix production environments.

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