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EP6STC-80 is a one-component, non-frozen, silver-filled epoxy designed for bonding, sealing, and coating applications requiring thermal and electrical conductivity. The system provides unlimited working life at room temperature and cures at 80°C. Thermal conductivity is rated at 13–14W/(m·K), with volume resistivity below 0.001ohm-cm. Operates across a temperature range of -60°C to 150°C and bonds to metals, ceramics, composites and plastics. It meets NASA low outgassing requirements and contains no solvents or diluents. The epoxy exhibits a tensile modulus of 1,400,000–1,800,000psi at 25°C and cures in 3–5 hours at 80°C. Formulated as a thixotropic paste with viscosity between 500,000–1,500,000cps, supporting manual and automated dispensing. Packaging options include syringes from 20g to 100g and jars up to 200g.

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Compliance Agent automates regulatory data collection, validation and reporting for electronics manufacturing services (EMS) workflows. The system captures compliance data including RoHS and REACH status, material declarations, conflict minerals with smelter information, and other regulatory requirements such as TSCA and Prop 65. Validates incoming supplier data, generates configurable compliance reports, and retrieves missing information through automated supplier communication. Continuously monitors regulatory updates and supplier status changes, alerting users to impacts on bills of materials and incorporating new data as it becomes available. Designed to reduce manual compliance tasks and support ongoing regulatory management across global supply chains.

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Workbench configurator platform supports design and visualization of modular workstation environments using Treston and IAC solutions. Enables users to configure workbenches, storage systems and accessories through an interactive interface with real-time layout adjustments. Supports selection of standard and custom configurations to align with production requirements and facility constraints. Provides visualization tools to compare layouts and assess integration into existing manufacturing lines. Designed to streamline workstation planning, reduce design time and support coordination across engineering, production and procurement teams.

Cumberland Electronics Strategic Supply Solutions

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Omnyx PCBA test platform supports detection of structural, parametric, high-speed interconnect and functional defects in printed circuit board assemblies used in AI servers and data center systems. Combines synchronized analog and digital subsystems with mission-mode and software-directed testing to identify at-speed and operational defects earlier in the manufacturing process. Supports single-site, multi-site and large-format test architectures with pin capacity from 2,560 to more than 10,000 pins. Accommodates PCB sizes up to 900×750mm and weights up to 15kg. Includes no-touch high-speed conveyance with SMEMA compatibility and supports automated or manual fixture configurations. Designed to improve yield, product quality and test coverage in high-performance computing hardware production.

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EHS-222M-L highly accelerated stress test chamber supports reliability testing of large multilayer PCBs and high-density electronic assemblies. Accommodates board sizes up to 290×460mm with increased internal depth and expanded fixture capacity for high specimen volumes. Provides up to 120 bias terminals at up to 1,000V to support complex testing configurations. Operates across temperature range of +105.0°C to +142.9°C, humidity range of 75%–100%RH and pressure range of 0.019–0.193MPa. Supports accelerated reliability testing for AI hardware, automotive electronics and data center systems requiring high-temperature, high-humidity and pressure conditions.

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The Mydata Midas tool 2026-5652 supports placement of the N61381US component in SMT assembly processes. The tool features a 0.125" outside diameter and 0.047" inside diameter with a 90° V-cut profile designed to align and seat components during placement. It is pinned to D121 to maintain alignment and positioning consistency during pick-and-place operations. The geometry supports stable handling of specialized components and consistent vacuum performance for automated assembly environments. The tool is designed for use on MYDATA systems and supports applications requiring precise component placement and handling of non-standard geometries.

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