New Products
Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates.
ASYS VEGO GenS handler has modular design and up to 20% faster cycle time than previous models.
Cencorp 1500 OF EVO 2 odd-form placement machine features large feeder bench capable of handling up to 24 different components in all sizes.
Juki RS-2 placement machine offers high-speed placement up to 50,000cph, aided by laser sensor closer to the board and reduces travel time from pick-up to placement.
Indium Corp. SiPaste C312HF halogen-free, cleanable solder paste is for fine-feature printing.
Automated Production Equipment (A.P.E.) Intruder is a complete hot air BGA rework station with split vision placement/removal capability.
Press Releases
- Nordson Electronics Solutions to exhibit innovations for conformal coating and selective soldering at APEX Expo 2026 booth # 1831
- Boardera Launches EU Data Hosting for PCB Costing Platform
- ECIA Issues Industry Alert on Recent Tariff Developments
- Altus Expands Advanced X-ray Inspection at Prototype Electronics