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The “other” major electronics manufacturer in Everett, WA, is spreading its wings.

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MLF trials show relatively soft vacuum levels and short hold times can significantly lower voiding.

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Do trade wars and mergers portend a coming changing of the guard?

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But those planning to use both must identify who is responsible for key requirements.

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A new way to assess up to 25 solder paste properties on an assembly line in five hours or less.

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The feasibility of high-volume microminiature component manufacturing using Type 5 and 6 pastes.

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