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A marginally larger package would cut design times and improve PCB yields and performance.

Most electronics engineers know there is no 1.1mm BGA or CGA package. Because we are forced to use a 1mm pitch package, we live with tradeoffs. A slight increase in the pitch size, however, could satisfy the needs for today’s high I/O pin count designs.

This conclusion comes from my observations of building Class 3 and aerospace 1mm pitch products, and the challenges, setbacks, redesigns, returned product, and field failures we all endure.

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Electrical and physical characteristics play a role in high-accuracy detection.

Most multilayer ceramic capacitors (MLCC) have no marking and cannot easily be distinguished from their package, which gives unscrupulous vendors opportunities for fraud. Here, the authors introduce several test methods for MLCC compliance verification, namely 1) the effect of DC bias on capacitance, 2) capacitance temperature characteristics, 3) high-voltage testing of DCW (dielectric withstand voltage) and IR (insulation resistance), 4) cross-section (dielectric layer and terminal comparison for flex types), and 5) electron microscopy (EDS) material analysis to match with known good device chemical composition.

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Is manufacturing at scale a building block of your development plan? 

Beyond conception, bringing a new product to life is a challenge. From the saying that “hardware is hard” to the number of failed product launches and missed deadlines (behind the scenes of all major consumer products we use today), we’ve compiled a few important lessons learned to help founders and engineers on their product development and manufacturing adventures. Too many design projects go to waste or must restart from scratch because manufacturing at scale wasn’t a building block of the development plan. Here are five things OEMs and EMS companies should do to better ensure a seamless transfer of programs from proto to volume:

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Annual career development program features talks on automotive safety systems and quality. 

In the wake of Covid-19, SMTA International is virtual this year, and so is the Women’s Leadership Program! It is a challenging time for everyone, but we can concentrate on developing our careers by charting a positive course now. Join the “Road Trip” for a program of technical presentations, speed networking and a connection reception. Although some aspects of the WLP will be different – such as two speakers instead of three, and a completely virtual event – we believe it will still be one of the best platforms to connect with colleagues within our industry.

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FTIR, SEM/EDS and ion chromatography used in concert with a pair of extraction methods offered varying degrees of precision.

A group of 25 conformal-coated, no-clean assemblies was placed in an environmental test chamber at 40°C/90%RH for 168 hr. under functional conditions. Each assembly was tested with its plastic/metal enclosure on the unit; large openings in the enclosures permitted the assemblies to be exposed to the environmental conditions. Twenty-two units produced dendrites in multiple locations; all grew shorts on the SMT pad without components (FIGURE 1). The units were biased with 3.3V for 168 hr. at 40oC/90%RH.

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Updates in silicon and electronics technology.

Ed.: This is a special feature courtesy of Binghamton University.

Generating electricity out of thin air. University of Massachusetts researchers have developed a device that uses natural protein to create electricity directly from moisture in the air, a technology that could have significant implications for the future of renewable energy, climate change, and medicine. The device is called an “Air-gen,” or air-powered generator, with electrically conductive protein nanowires produced by the Geobacter microbe. The Air-gen connects electrodes to the protein nanowires where the electrical current is generated from the water vapor naturally present in the atmosphere, literally making electricity out of thin air. The Air-gen generates clean energy 24/7 and is an exciting application of protein nano. (IEEC file #11678, UMass Amherst, 3/17/20)

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