Circuits Assembly Online Magazine

NEWS

Global Semiconductor Sales Decrease 0.3% in October

WASHINGTON — The Semiconductor Industry Association announced global semiconductor industry sales were $46.9 billion during the month of Oct... Read More...

ICAPE Group Acquires MMAB Group

FONTENAY-AUX-ROSES, FRANCE — ICAPE Group, a global technology distributor of printed circuit boards, announced Monday that it has acquired 1... Read More...

PCEA Issues Call for Abstracts for PCB West 2023

PEACHTREE CITY, GA — The Printed Circuit Engineering Association (PCEA) seeks abstracts for its annual PCB West (https://www.pcbwest.com) te... Read More...

Note to Expand Facility in Norrtälje, Sweden

STOCKHOLM — NOTE has signed an agreement to expand its plant in Norrtälje, Sweden by around 1,100 sq. m. to increase the facility's capacity... Read More...

New Report Identifies Challenges to Continued US Leadership in Semiconductor Design, Innovation

WASHINGTON — The Semiconductor Industry Association (SIA) and the Boston Consulting Group (BCG) have released a report finding continued US ... Read More...

Global Semiconductor Equipment Billings Up 9% in Q3, SEMI Reports

MILPITAS, CA – Global semiconductor equipment billings rose 7% year-over-year to $28.75 billion in the third quarter, SEMI announced today. ... Read More...

ECIA Publishes Publishes China Tariff Avoidance and Recovery Process Document

ATLANTA — The ECIA’s Global Industry Practices Committee (GIPC) has published a document to update members on best practices as companies in... Read More...

TechSearch Releases Advanced Packaging Update

AUSTIN, TX — TechSearch International's latest Advanced Packaging Update describes some of the thermal challenges facing the industry from m... Read More...

Tata Reportedly in Talks to Acquire Wistron's India Facility

MUMBAI — Tata Group is in talks with Wistron to acquire the Taipei-based corporation's facility in Karnataka, India, for up to 50 billion ru... Read More...

FEATURES

Updating an Existing Printed Circuit Board Design

A basic process for revising a client-supplied CAD database. Not all designs start from scratch. Not all designs start with a schematic and then “ECO’ing” it i... Read More...

Addressing Low-Temperature Rework Concerns

Material properties and considerations of a eutectic SnBi solid wire and SAC 305 flux cored wire. Low-temperature (LT), high-bismuth solders are being carefull... Read More...

The Heat is Off: Could a New Platform Revolutionize Soldering?

New technology from Safi-Tech means cold solder joints might no longer mean defects. I’ve been covering the soldering industry for more than 30 years. During t... Read More...

Why I4.0 and Reshoring Go Hand in Hand

The path to digitize a factory is both closer and cheaper than most engineers realize. Reshoring has been a buzzword for a few years now. But when supply chain... Read More...

Robust Tacking Material Technology to Reduce Tool and Fixturing Complexity in Power Module Assembly

A solution for flux-free formic acid reflow? Growing performance demands for power electronics systems, driven by rapid advancements in application areas su... Read More...

M2M Communication is Here. Do We Still Need Judgment Calls?

Data-driven processes require IP coordination among vendors – and that means humans. We hear a lot these days about smart manufacturing, but is there a broad c... Read More...

Tackling Head-in-Pillow Defects with Vapor Phase Reflow

An EMS finds VPS dramatically reduced HiP in BGA/LGA connectors. Head-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boa... Read More...

Defluxing of Copper Pillar Bumped Flip-Chips

A case study showed a well-balanced aqueous cleaning agent removed Pb-free, water-soluble tack flux residues better than straight DI water. Solder bump technol... Read More...