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NEWS

Sanmina Reports Fiscal Q1 Revenue Down 16%

Sanmina Reports Fiscal Q1 Revenue Down 16%

SAN JOSE – Sanmina reported fiscal first quarter revenue of $1.8 billion, down 15.9% year-over-year and 2.8% sequentially.  Read More...

Smart Factory Expo Takes Place Feb. 12-14 in Tokyo

Smart Factory Expo Takes Place Feb. 12-14 in Tokyo

TOKYO – Smart Factory Expo will be held at Tokyo BigSite Feb. 12-14, in conjunction with RoboDex and the Wearable Expo.  Read More...

Incap acquires AWS Electronics

Incap acquires AWS Electronics

HELSINKI – Incap Corp. signed an agreement to acquire AWS Electronics Group for an undisclosed sum.  Read More...

Report: 61% of Manufacturing Companies Need to Reevaluate AI Implementation

Report: 61% of Manufacturing Companies Need to Reevaluate AI Implementation

PALO ALTO, CA – While manufacturing companies see the value in implementing artificial intelligence, many are struggling to deliver clear re...  Read More...

iNEMI Publishes 3 Additional Roadmap Chapters

iNEMI Publishes 3 Additional Roadmap Chapters

MORRISVILLE, NC — iNEMI released three additional chapters from its 2019 Roadmap: Flexible Hybrid Electronics, Organic PCB and Portable and ...  Read More...

Plexus Reports Fiscal Q1 Revenue Up 11%

Plexus Reports Fiscal Q1 Revenue Up 11%

NEENAH, WI – Plexus reported fiscal first quarter revenue of $852.4 million, up 11.3% year-over-year and 5.2% sequentially.  Read More...

BlueRing Stencils Acquires Stone Mountain Tool

BlueRing Stencils Acquires Stone Mountain Tool

LUMBERTON, NJ – BlueRing Stencils acquired Stone Mountain Tool for an undisclosed sum.  Read More...

Zentech Acquires Trilogy Circuits

Zentech Acquires Trilogy Circuits

DALLAS, TX – Zentech Manufacturing has acquired Trilogy Circuits for an undisclosed sum.  Read More...

Keytronic Expects Fiscal Q2 Revenue on Low End of Guidance

Keytronic Expects Fiscal Q2 Revenue on Low End of Guidance

SPOKANE VALLEY, WA – Keytronic expects to report revenue of approximately $117 million for the fiscal second quarter ended Dec. 28, on the l...  Read More...

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FEATURES

Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure, Reliability and Failure Mechanism

Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure, Reliability and Failure Mechanism

How do LTS solders perform under thermal cycling and drop-shock testing?  Read More...

An Automated Tin Whisker Risk Assessment Process Resulting in Significant Cost Savings

An Automated Tin Whisker Risk Assessment Process Resulting in Significant Cost Savings

How a modified design tool automated and standardized TWRA measurement.  Read More...

Why ‘Born on Dating’ is Not a Reliable Means for PCB Shelf Life

Why ‘Born on Dating’ is Not a Reliable Means for PCB Shelf Life

Flex circuit solderability and life expectancy are influenced by handling and finishes. What is the shelf life of a flex circuit if it stays in its original ...  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

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PRODUCTS

MacDermid Alpha Releases Staydry Z20 Film

MacDermid Alpha Releases Staydry Z20 Film

Staydry Z20 is a silicone film moisture getter for hermetic packages.  Read More...

Master Bond Introduces EP17HTS-DA Die-Attach Epoxy

Master Bond Introduces EP17HTS-DA Die-Attach Epoxy

Master Bond EP17HTS-DA is a one-component, no-mix, electrically conductive die-attach epoxy.  Read More...

Rohde & Schwarz Upgrades R&S RTO-/RTP-K133 Oscilloscopes

Rohde & Schwarz Upgrades R&S RTO-/RTP-K133 Oscilloscopes

R S RTO-/RTP-K133 advanced jitter analysis option for R S RTO and R S RTP oscilloscopes helps development engineers gain insight into individual jitter componen...  Read More...

Vishay Offers TMBS Rectifiers with 2A, 3A Devices

Vishay Offers TMBS Rectifiers with 2A, 3A Devices

TMBS Trench MOS Barrier Schottky rectifiers are now with 16 2A and 3A devices in eSMP series low-profile SMP package.  Read More...

Yamaha Motor Launches YRM20 Placement Machine

Yamaha Motor Launches YRM20 Placement Machine

YRM20 chipshooter uses two head types: a high-speed, multi-purpose rotary head that, when combined with the high-speed feeder, delivers performance under optima...  Read More...

Keysight Unveils DDR5 Design and Test Workflow

Keysight Unveils DDR5 Design and Test Workflow

Design and test workflow reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems.  Read More...

Amphenol SV Microwave Releases Solderless PCB Connectors

Amphenol SV Microwave Releases Solderless PCB Connectors

Micro-Mini (SMP/SMPM) extreme frequency subminiature RF/coaxial push-on solderless PCB compression mount connectors are for high-frequency printed PCBs.  Read More...

YesTech Launches LX-1000 AOI

YesTech Launches LX-1000 AOI

LX-1000 inline large-area optical inspection system offers 630mm x 630mm inspection area with single-or dual-sided imaging.  Read More...

Sono-Tek Debuts FlexiCoat EMI Ultrasonic Coating

Sono-Tek Debuts FlexiCoat EMI Ultrasonic Coating

FlexiCoat EMI ultrasonic coating is designed for conformal spraying of EMI shielding material onto semiconductor packages.  Read More...

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