Circuits Assembly Landing Page Showcase

• Dedicated vs. Flexible Board Support

  A good seal between stencil aperture and solder pad ensures the best solder paste deposition.

  https://circuitsassembly.com/ca/editorial/menu-features/32318-dedicated-vs-flexible-board-support.html

• Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems

  Testing transfer efficiency and repeatability for microminiature devices down to 01005 discretes and 0.4mm BGAs.

  https://circuitsassembly.com/ca/editorial/menu-features/32317-comparison-of-aperture-designs-solder-pastes-nanocoatings-and-print-inspection-systems.html

• Clarifying Through-Hole Fill Levels

  IPC-STD-001 is revising criteria for voiding and fill percentage.

  https://circuitsassembly.com/ca/features-itemid-fix/415-test-and-inspection/32304-clarifying-through-hole-fill-levels.html

• Pitfalls of EMS Market Analyses

  With so much research data available, how do you know what to believe? An analyst explains the flaws with most studies.

  https://circuitsassembly.com/ca/editorial/menu-features/32095-pitfalls-of-ems-market-analyses-in-europe.html

• Market Forces and Regulations Converge on Eco-Design

  A common misconception is that eco-design adds costs to products. In fact, nearly every eco-design principle reduces product costs. The first of an occasional series by the authors of the 2019 iNEMI Roadmap.

  https://circuitsassembly.com/ca/editorial/menu-features/31752-market-forces-and-regulations-converge-on-eco-design.html

• Evolving Production from Job Shop to One-Piece Flow

  How a PICK analysis helped cut EMS staff by 19% and raise production output 24%.

  https://circuitsassembly.com/ca/editorial/menu-features/31895-evolving-production-from-job-shop-to-one-piece-flow.html