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NEWS

Zetwerk Plans Expansion of Manufacturing Capacity

Zetwerk Plans Expansion of Manufacturing Capacity

NEW DELHI – Zetwerk has announced a Rs1,000 crore ($119.6 million) investment to ramp up its electronics manufacturing capacity.  Read More...

Semiconductor Equipment Sales Decrease 1% in 2023

Semiconductor Equipment Sales Decrease 1% in 2023

MILPITAS, CA – Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of...  Read More...

Colorado EMS to Expand, Add 100 Jobs

Colorado EMS to Expand, Add 100 Jobs

COLORADO SPRINGS, CO – Spectrum Advanced Manufacturing Technologies has received $1.3 million in tax credits from the Colorado Economic Deve...  Read More...

IPC Publishes Strategy to Address Electronics Industry’s Workforce Challenge

IPC Publishes Strategy to Address Electronics Industry’s Workforce Challenge

BANNOCKBURN, IL – IPC has released an expansion of its strategy to address the workforce challenges of the US electronics manufacturing indu...  Read More...

Manufacturing Technology Orders Fall 26.5% in February

Manufacturing Technology Orders Fall 26.5% in February

MCLEAN, VA – Orders of manufacturing technology totaled $343.3 million in February, marking a 2.1% increase from January but a 26.5% decline...  Read More...

Global PC Shipments Return to Growth in Q1

Global PC Shipments Return to Growth in Q1

NEEDHAM, MA – After two years of decline, the worldwide traditional PC market returned to growth during the first quarter with 59.8 million ...  Read More...

ASMPT Reports 24% Decline in Annual Revenue

ASMPT Reports 24% Decline in Annual Revenue

SINGAPORE – ASMPT reported full-year revenue of HK$14.7 billion ($1.9 billion), down 24% from 2022.  Read More...

Electronic Component Sales Sentiment Continues to Brighten

Electronic Component Sales Sentiment Continues to Brighten

ATLANTA – Optimism continues to improve in the electronic components supply chain as overall sentiment rose to 106.9 in the latest results f...  Read More...

IPC Releases “J” Revisions to 2 Electronic Assembly Standards

IPC Releases “J” Revisions to 2 Electronic Assembly Standards

BANNOCKBURN, IL – IPC has announced the release of "J" revisions for two standards often used together for the manufacture of elec...  Read More...

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FEATURES

Preserving Solder Paste Integrity

Preserving Solder Paste Integrity

A closer look at mixing methods and automated mixers. While automation in manufacturing brings efficiency and consistency, the use of automated solder paste mi...  Read More...

Exploring the Impact of AI

Exploring the Impact of AI

A special panel discusses the growth of AI tools and its possible effects on the industry. “Will AI take my job?” That’s the question on the mind of many arou...  Read More...

Can Artificial Intelligence Solve Manufacturing Problems?

Can Artificial Intelligence Solve Manufacturing Problems?

Why Andrew Scheuermann thinks AI will be the assistant every engineer has needed. We in electronics design and manufacturing know automation is part and parcel...  Read More...

Low-Temperature Solder: Challenges, Opportunities and Considerations

Low-Temperature Solder: Challenges, Opportunities and Considerations

An exploration of the factors affecting the development and growth of low-temperature soldering. Low-temperature soldering (LTS) is a rapidly developing field ...  Read More...

Optimized Materials to Deliver Ruggedized Electronics

Optimized Materials to Deliver Ruggedized Electronics

A showcase of testing methods used in the development of robust materials. Ruggedization means “to strengthen (something, such as a machine) for better resista...  Read More...

Windy City Tour

Windy City Tour

Chicago’s EMS companies place an emphasis on responsiveness. While major manufacturing centers in Mexico, plus the more than 250 EMS companies in the Silicon V...  Read More...

High-Density Interconnect Technology: An Overview

High-Density Interconnect Technology: An Overview

Design and manufacturing considerations for HDI PCBs. High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics ind...  Read More...

'A Good First Step': PCBAA Talks Legislation Status

'A Good First Step': PCBAA Talks Legislation Status

PCBAA's executive director lauds recent funding wins but says the heavy lifting remains. Year-end is typically not the time when big announcements are made, bu...  Read More...

Green Strength: The CIRCUITS ASSEMBLY EMS Company of the Year

Green Strength: The CIRCUITS ASSEMBLY EMS Company of the Year

An emphasis on speed – same day turns! – keeps Green Circuits’ customers coming back. When we last visited Green Circuits, in late 2018, the company was just c...  Read More...

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PRODUCTS

Samtec Releases Narrow Body RF Edge Launch Connectors

Samtec Releases Narrow Body RF Edge Launch Connectors

Samtec's RF edge launch connectors with a narrow body design that is said to be 33% smaller than traditional edge launch connectors.  Read More...

Panasonic Rolls Out NPM-GH Pick-and-Place Machine

Panasonic Rolls Out NPM-GH Pick-and-Place Machine

Panasonic Connect's NPM-GH is a pick-and-place machine with a mounting accuracy of ±15µm.  Read More...

Vishay Launches New TVS Series

Vishay Launches New TVS Series

Vishay Intertechnology's four new series of transient voltage suppressors (TVS) are designed to enhance protection and efficiency in automotive and industrial e...  Read More...

Master Bond Releases EP114 Underfill Epoxy

Master Bond Releases EP114 Underfill Epoxy

Master Bond's EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impr...  Read More...

MVP Releases Versa Duo AOI

MVP Releases Versa Duo AOI

Machine Vision Products' Versa Duo AOI features high-resolution optics technologies and a laser profiler to offers advanced inspection across multiple markets. ...  Read More...

Würth Elektronik Launches Sulfur-Resilient Resistors

Würth Elektronik Launches Sulfur-Resilient Resistors

Würth Elektronik's WRIS-RSKS family of anti-sulfur resistors is aimed at manufacturers of durable electronics for applications susceptible to exposure from sulf...  Read More...

Nordson Releases Synchro 3 Soldering System

Nordson Releases Synchro 3 Soldering System

Nordson Electronics Solutions' Synchro 3 selective soldering system is a new model in the SELECT Synchro series that offers up to three solder pots to match man...  Read More...

Mycronic Rolls Out DeepReview ADC System

Mycronic Rolls Out DeepReview ADC System

Mycronic's DeepReview automatic defect classification system leverages AI to reduce false call rates will improving first-pass-yield in 3-D AOI.  Read More...

Henkel Launches Semiconductor Capillary Underfill Encapsulant

Henkel Launches Semiconductor Capillary Underfill Encapsulant

Henkel's Loctite Eccobond UF 9000AE is designed to protect large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging de...  Read More...

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