Step-by-step failure analysis guidelines assist in determining root causes.

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In an era where delays cannot be tolerated, help has to come from the “interface” between layout design and manufacturing.

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Conductive inks on polyester can save 25% or more on the substrate cost compared with an equivalent copper circuit.

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Gary CarterThe industry is asked for feedback on reducing bottlenecks in the CAD-manufacturing process.

Last year was a watershed year for the IPC-2581 standard.

A broad cross-section of printed circuit board software suppliers, OEMs, equipment suppliers, manufacturers, and service suppliers, having implemented IPC-2581 both in trial and production use, provided significant positive feedback to the IPC 2-16 committee regarding their experiences utilizing the standard to produce PCBs. Working closely with the IPC-2581 Consortium’s technical committee, many of these adopters proposed feature enhancements, leading to IPC-2581B Amendment 1, published in January of this year. This release supports the most comprehensive set of industry requirements for printed circuit board fabrication, assembly and test in a data-centric, open, license-free, industry-driven standard format. On behalf of the IPC 2-16 Committee, I would like to extend our sincere gratitude to all who participated in this effort.

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Root causes of HiP are hard to identify, but often involve component warpage.

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Is a high-mix environment suitable for a pull signal setup?

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