Data-driven processes require IP coordination among vendors – and that means humans.

We hear a lot these days about smart manufacturing, but is there a broad consensus on what it means, and more specifically, its application in electronics assembly? Brian Morrison, vice president of engineering for Vexos, a mid-tier multinational EMS with manufacturing facilities in the US, Canada, China and Vietnam and more than 900 employees worldwide, explains his views on smart manufacturing to PCD&F/CIRCUITS ASSEMBLY in July.

Political and supply-chain issues could not slow printed circuit growth in 2021.

 The author attended his first IPC meeting in 1966. At that time, the consensus was the world PCB output was $500 million. Some “knowledgeable” experts predicted PCB output would dwindle since semiconductors were rising rapidly and PCBs would not be needed. If that $500 million assessment was correct, in 55 years the PCB market grew 192 times, to $96 billion!

An EMS finds VPS dramatically reduced HiP in BGA/LGA connectors.

Head-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid array (BGA/LGA) packages. These defects can result in costly repairs and reduce a component’s lifespan. HiP defects are compromised solder joints often attributed to undesired environmental factors during the reflow process. These factors include reflow in an oxygen-filled environment, exposure to temperatures surpassing a component’s thermal limit, and uneven thermal distribution across the PCB.

A new specification tackles the application and performance of organic solderability preservatives.

After many years of starts, stops and debate, an industry committee has finally developed a standard for organic solderability preservatives (OSPs). IPC-4555, Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards, is out now, and it was a long time coming.

With the electronics industry fully entrenched in lead-free soldering, a standard for OSP is critical. There are more stringent requirements for solder joint reliability, resistance to corrosion, as well as additional requirements related to complex substrate designs.

The development and acceptance of IPC-4555 dispels the myth all OSPs are the same. With circuit boards fabricated around the globe, and small chemical firms attempting to introduce “new OSP processes,” buyers must be aware. Greater solderability requirements – measured as joint strength, paste spreadability and hole fill – and higher temperatures of lead-free soldering have greatly diminished use of conventional (standard substituted benzimidazole-based) OSPs. With the development of third- and fourth-generation organic solderability preservatives based on a novel aryl-phenylimidazole compound, however, OSP has regained its leadership role as a final finish, particularly in Asia and Europe. In addition, the technology shift to bare copper PWBs with selectively plated gold features requires OSPs that do not tarnish or deposit on the gold.