Will through-hole components become obsolete?

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Characterization results of several Pb-free solder pastes show one capable of low-aspect ratio printing.

Ed.: Part 1 appeared in the January 2017 issue of PCD&F/CIRCUITS ASSEMBLY.

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By tightening controls over materials, the risk of recalls and fakes is slashed.

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At the beginning of January, PCD&F/CIRCUITS ASSEMBLY asked a number of PCB industry executives to answer a handful of questions about the upcoming year.

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Counterfeit avoidance standards need additional detail for addressing and mitigating key risks.

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Characterization results of several Pb-free solder pastes show one capable of low-aspect ratio printing.

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