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New Products

Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.

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BGA-006 optical inspection unit provides side-view BGA inspection.

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Sustained ring soldering module permits preassembled solder rings to be placed on and around THT pins, which are then melted by laser, piston or induction soldering, or IR emitters, hot air or thermodes.

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RMCA series is AEC-qualified and has excellent long-term reliability for automotive applications.

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EO-B-016 no-clean, alcohol-based flux has been developed for selective soldering.

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iPure-1 high-capacity fume extraction system was developed for high-capacity dispensing and conformal coating line applications and adsorption of harmful volatile organic compounds emitted during these processes.

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