New Products
Yamaha Robotics' VP-01G-Y solder paste inspection system uses advanced algorithms in 2-D and 3-D modes to aid focusing and contour extraction.
Delvitech's 3iS AOI system is designed to ensure scalability and inspection repeatability on all production lines by deploying identical hardware and software technology for each inspection phase.
Hitachi's FT210 analyzer includes a proportional counter detector for routine measurements of common platings and incorporates features designed to enhance high-volume testing needs.
TRI's TR7600F2D QL AXI is designed for the evolving needs of large board applications, especially in automotive and telecommunications electronics manufacturing.
Kyocera's 159-7X0 series is its first linear card-edge connectors to feature a beryllium copper spring contact system, which is said to deliver high electrical and mechanical reliability, high signal integrity and high durability in harsh environment applications.
Press Releases
- Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
- ZESTRON Welcomes Whitlock Associates as New Addition to their Existing Rep Team in Florida
- ROCKA to Showcase Expanded Services and Top Distribution Brands at Three SMTA Expos in May
- Instrumental joins NVIDIA Metropolis to Enable Fully Automated Defect Detection for Complex Electronics Assembly