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New Products

NexygenPlus 4.1 materials testing software is for testing physical properties of raw material prior to processing, and for development of new electronics design and functionality.

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3880-II die bonder includes options to maximize productivity, reduce programming time by up to 95% and improve bonder productivity.

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Thin film wraparound PHPA series resistors have power ratings of 1.0W and 2.5W in 1206 and 2512 case sizes, respectively, with a self-passivated tantalum nitride film for moisture resistance.

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9771 conformal coating is for use on printed circuit boards in missiles, satellites, and spacecraft. Is dual-cure and reworkable, and cures with light and moisture to ensure material that flows underneath components on PCBs fully cures.

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3Di-LS2-CASE 3-D AOI has unique, highly rigid gantry structure and AI-based inspection automation functionality reduce false calls for solder defects (non-wetting) and improves speed and accuracy of solder defect detection.

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SLX is a zero-setup profiling system for reflow and wave solder applications.

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