New Products

Type AuR gold ribbon bonding wire is fabricated to 4N specifications with 99.99% purity using a dry process.

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PF606-PW215 water-soluble solder paste provides high-speed printability that reportedly produces great solder paste print quality, as well as a wide reflow process window for excellent solderability.

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Sarcon 15GTR is a thin thermal interface composite film made from heat-conducting silicone and a 0.05mm fiberglass reinforcement layer.

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Pen-Vac Kit is self-contained with eight probes plus cups and vacuum pen holder.

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Scanflex II Cube JTAG/boundary scan controller has an optional Wireless LAN interface.

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Master Bond EP21ND-LP two-part epoxy is for structural bonding applications involving large surface areas.

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