Heraeus Electronics’ mAgic® PE360 is a silver sintering material developed for large-area power module attachment applications requiring high thermal and mechanical performance. The material enables uniform bond lines and low voiding. mAgic® PE360 sinters at relatively low pressure and temperature. The material is available in both printing (PE360P) and dispensing (PE361D) formats.

Hirose's 1.0mm coaxial connector designed for high-frequency applications up to 110GHz. The connector complies with IEEE Std 287 and is engineered to support advanced RF and microwave designs. Features a compression-mount center contact that accommodates a range of PCB thicknesses, from under 1mm to several millimeters. With voltage standing wave ratio (VSWR) values of 1.8 maximum from 0–67GHz and 1.9 maximum from 67–110GHz. These characteristics support applications where signal integrity and low insertion loss are critical.

ASMPT Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution.

Mycronic MYPro A41DX and A41SX placement machines handle boards up to 1,000mm x 609mm in size, 12.5mm thick and up to 10kg using new T1000 conveyor.