Shenmao PF606-P lead-free solder paste for use in "reverse hybrid" board assembly is compatible with existing SAC SMT materials and reflow processes.

Vishay LTO 150H resistor handles higher pulse energy for protection in high-stress environments. Absorbs up to 75J/0.1s and dissipates 150W at 45°C, with low thermal resistance for stability. Supports resistance values from 1Ω to 2.2 kΩ and operates at up to 175°C in EV, industrial, and telecom systems.Page Break

Vishay Intertechnology, Inc.

http://www.vishay.com/

CE3S Millice StripAid X series biodegradable solvent removes WaferGrip and TrueGrip adhesives. Suitable for wafer thinning, ultrasonic agitation, and high-temperature debonding. Enables safer, cleaner semiconductor processes with simplified storage.Page Break

CE3S

www.ce3s.comwww.ce3s.com

Saki Corp. 3Xi-M200 AXI now has upgraded software that improves solder joint defect detection for power modules, including those with thick baseplates and heat-dissipating finned structures.