Test Research Introduces TR7950Q SII Wafer Inspection Platform
Wafer inspection and metrology platform supports advanced packaging and back-end semiconductor processes. The system accommodates 6" to 12" wafers and integrates automated visual inspection for detection of particles, scratches, chipping, contamination and foreign materials. Granite-based structure supports system stability, with optional short-wave infrared module enabling detection of subsurface defects within silicon. 3D depth-from-focus module offers imaging at 0.5µm or 1µm resolution for detailed surface analysis. Platform performs metrology for wafer thickness, top-side warpage and surface topography, along with measurement of through-silicon via depth, trench dimensions, thin films and chiplet features. Designed for inspection and measurement applications across advanced packaging workflows.
Test Research
