Dow Launches DOWSIL TC-3120 Thermal Gel
Silicone-based thermal interface material supports heat dissipation in optical modules, dense electronics and high-speed data applications. DOWSIL TC-3120 Thermal Gel provides thermal conductivity of approximately 12W/m·K and is designed to minimize oil bleeding and condensed outgassing to help maintain optical-grade cleanliness. Flowable, one-part material supports minimum bondline thicknesses of 200µm, fills large gaps and can be reworked after curing. Designed for 800G and 1.6T optical modules, telecommunications equipment, electronic module assemblies, autonomous vehicles and automotive electronic controllers. Material resists thermal cycling, shock, vibration and slumping in vertically oriented assemblies while supporting module-to-heatsink interfaces with uneven surfaces or tolerance stackups.
Dow
