Henkel Launches Technomelt PA 6370 Low-Pressure Molding Material
Henkel expanded its Technomelt portfolio with the PA 6370 low-pressure molding material for electronic assemblies requiring fine-gap filling and environmental protection. Polyamide-based hot melt formulation supports gap penetration down to 0.5mm with ultra-low melt viscosity from 2700–3000mPa·s at 210°C and 1065–1180mPa·s at 240°C. Material provides adhesion stability across multiple substrates and passed lap shear testing after 1,200hr exposure to 85°C/85% RH conditions. Technomelt PA 6370 meets UL 94 V-0 flame retardancy requirements and offers electrical insulation properties with a coefficient of thermal expansion of 175ppm. Operating temperature range spans -20°C to 140°C. Henkel said the material supports low-pressure molding processes with cycle times as low as 30 sec., targeting faster encapsulation compared to conventional potting approaches.
Henkel
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