Products
TSD-100 thermal shock chamber can meet the Mil-Std 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. Overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
Has an interior of 28 x 16”.
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
Other features include: a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.
ESPEC Corp., espec.com
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
Has an interior of 28 x 16”.
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
Other features include: a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.
ESPEC Corp., espec.com
B2 Benchtop automated optical inspection system for post-reflow PCBs is said to offer up to a three times improvement in inspection speed and improved fusion lighting to provide defect coverage. Features large board handling in a compact package, and complete software/board setup compatibility with the inline F1 series.
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
YESTech, yestechinc.com
Booth 2178
Booth 2178
YESPC software provides real-time process monitoring. Continuously monitors inspection results, so users can immediately react to critical process events. In a networked environment, user defined charts and alarms can be accessed remotely via Web browsers. It can also provide email alerts.
Provides diagnostic and trending analysis of the manufacturing process.
Features a package of SPC charts, including X-bar range, X- moving range, histogram, Pareto analysis, scatter plot, Cp, CpK and other reports that provide real-time alarms for out-of-tolerance conditions. Compatible with YESTech AOI and YTX-5000 combined x-ray/vision system.
YESTech, www.yestechinc.com
Apex booth 2178
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