Products
92-XCON OA flux is formulated for Pb-free soldering, and designed to withstand the high temperatures associated with Pb-free processing without breaking down or losing its activity. Said to offer a robust process window and combine freely rinsable, thermally stable synthetic polymers with a well-tuned activator system. Delivers metallurgically sound solder joints with a shiny appearance even under high thermal load. Cleans easily in a straight aqueous process, yielding circuit assemblies with extreme ionic cleanliness. Passes the Silver Chromate test for halides and is categorized as an IPC-Jstd-004 ORH0 product.
Cobar BV, cobar.com
Cobar BV, cobar.com
BPWin 4.58 features new NAND Flash options that will allow users to customize multiple partitions using a single algorithm when programming NAND devices.
Special Spare Area calculations can be added as needed without having to change the algorithm. The user can specify partitions with an arbitrary number of required addresses and specify how they align to the buffer. This feature is available to all NAND Flash devices that support it.
NAND Flash is used in numerous applications that involve the data file to be partitioned. For instance, the file may consist of an initial bootloader, followed by a bootup image, and data partitions. Depending on the application, each partition has a logical address to which it must map for correct functionality. Due to the presence of bad blocks, data on a device can shift, in terms of the actual address, to which it is programmed. It becomes essential that the algorithm used to program the NAND Flash guarantees that each partition starts at the exact specified logical address on the device. NAND Flash options in the BPWin software allow for this functionality.
Spare Area schemes allow fills or ECC (Error Correction Code) calculations “on the fly” during programming and verifying without modifying the buffer.
Special Spare Area calculations can be added as needed without having to change the algorithm. The user can specify partitions with an arbitrary number of required addresses and specify how they align to the buffer. This feature is available to all NAND Flash devices that support it.
NAND Flash is used in numerous applications that involve the data file to be partitioned. For instance, the file may consist of an initial bootloader, followed by a bootup image, and data partitions. Depending on the application, each partition has a logical address to which it must map for correct functionality. Due to the presence of bad blocks, data on a device can shift, in terms of the actual address, to which it is programmed. It becomes essential that the algorithm used to program the NAND Flash guarantees that each partition starts at the exact specified logical address on the device. NAND Flash options in the BPWin software allow for this functionality.
Spare Area schemes allow fills or ECC (Error Correction Code) calculations “on the fly” during programming and verifying without modifying the buffer.
BP Microsystems, bpmicro.com
A.C.E. Production Technologies introduces a Dual Head Fluxer option that facilitates quick changeover of flux types.
Is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. The feature enhances the flexible KISS 102 programmable selective soldering system. The dual head fluxing system makes it possible to change flux types quickly and complements a fast solder pot changeover time.
Is a spray-type, system, with controllable spray point size, pattern and deposition volume. The maintenance-free spray head is controllable down to a spot size of 2 mm.
Rugged, reliable and compact, the programmable KISS 102 features a Pb-free compatible solder pot and is ideal for assembly, prototyping and rework, post-reflow offline assembly and other soldering applications such as odd-form devices.
Is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. The feature enhances the flexible KISS 102 programmable selective soldering system. The dual head fluxing system makes it possible to change flux types quickly and complements a fast solder pot changeover time.
Is a spray-type, system, with controllable spray point size, pattern and deposition volume. The maintenance-free spray head is controllable down to a spot size of 2 mm.
Rugged, reliable and compact, the programmable KISS 102 features a Pb-free compatible solder pot and is ideal for assembly, prototyping and rework, post-reflow offline assembly and other soldering applications such as odd-form devices.
A.C.E. Production Technologies, ace-protech.com
Press Releases
- StenTech Strengthens Precision Parts Platform with AME Acquisition
- Count On Tools Enhances Selective Soldering Precision with Expanded Nozzle Lineup
- ViTrox Presents Advanced Inspection and Smart Manufacturing Solutions at NEPCON Asia 2025
- ASC Sunstone Circuits Adds New Options to OneQuote While Maintaining Real-Time Pricing on Core PCB Features