Products
SPRINTavi automatic in-line printer accepts the standard 29" (737 mm) stencil frame. Using Speedprint's "look down, look down" vision alignment technology, the printer facilitates "pase on stencil" inspection. The camera ensures 6 sigma repeatability.
Options include 2-D paste inspection, programmable paste dispenser, SPC data collection and tooling options such as a laser-guided tooling system and the Vacunest tooling package.
Designed for flexibility, easy changeover and long-term reliability.
A-Tek, atekllc.com
Options include 2-D paste inspection, programmable paste dispenser, SPC data collection and tooling options such as a laser-guided tooling system and the Vacunest tooling package.
Designed for flexibility, easy changeover and long-term reliability.
A-Tek, atekllc.com
Magnet Wire Stripping Pot strips film insulations from wires of all sizes and configurations. The wires are dipped into the stripping solution to quickly remove the insulation. This stripping method will not cause mechanical stress or abrasion to the conductor. Units are available in two models: DSP1 has basic temperature control and DSP2 has a programmable temperature control for selecting and maintaining an exact temperature. Both are available in 115V 60Hz or 220/240V 50/60Hz. Custom sizes can be quoted.
The Eraser Co. Inc., eraser.com
The Eraser Co. Inc., eraser.com
Finetech will highlight the Fineplacer Pico system in booth E1A02 during Nepcon China/EMT China on April 4-7.
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
Press Releases
- StenTech Strengthens Precision Parts Platform with AME Acquisition
- Count On Tools Enhances Selective Soldering Precision with Expanded Nozzle Lineup
- ViTrox Presents Advanced Inspection and Smart Manufacturing Solutions at NEPCON Asia 2025
- ASC Sunstone Circuits Adds New Options to OneQuote While Maintaining Real-Time Pricing on Core PCB Features