Products
LeadHound RoHS/Pb-Free Verification System will verify Pb-free or leaded components, sub-assemblies, PCBs and other items in as little as 15 sec.
Using micro-focus x-ray fluorescence (XRF), can detect the presence of lead, cadmium, mercury, chromium and bromine, as well as other elements, in a safe working environment and provide the percentage of each element found in a tested item. This enables shops to determine if an item complies with RoHS/WEEE directives or military and avionics specifications.
Can test several items in one session and generate a report for most requirements in 30 sec. Generates a report after each test that can be printed or stored as a file to meet applicable documentation needs.
In addition to testing boards and components, can detect lead in BGA spheres and solder paste in pots.
Can identify which items pass/fail the test and take appropriate action for a facility’s production requirements. In-depth reporting capabilities can tell the percentages or ppm of specified elements in each item.
Runs on a stand-alone, Windows XP-based computer. The x-ray system can be standardized at lunch or dinner breaks midway through production shifts. Power-up automatically initiates a standardization which takes approximately 3 min.
HEPCO, hepcoblue.com
Booth 1396
Booth 1396
Pentaplex Inc.’s High Energy Pulse Discharge capacitors reportedly set new standards of Low Equivalent Series Inductance and High Pulse Discharge Current. ESLs as low as 5 nanoHenrys and pulse discharge currents of 100,000 Amps have been achieved for a 100 KV 4.0 nanoFarad unit.
This was achieved by combining the oldest known inorganic dielectric, MICA, with a new proprietary manufacturing process based upon Pentaplex’s low-out gassing PCB technology at Fermi National Accelerator Laboratory.
Additional advantages: completely solid-state construction with no sealed containers to rupture or oil to leak. Form-factor is completely flexible; units can be custom made to thicknesses less than 1/2 cm for planar transmission line installation to a standard rectangular form factor to drop-in replace lower performance capacitors.
Temperature rating to 150°C thanks to the inert nature of the specially processed mica dielectric.
Range from 0.1 to100 nF and from 20,000 to 200,000 Volts.
Pentaplex Inc., pentaplexinc.com.
VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape,
etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
Focalspot, focalspot.com
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape,
etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
Focalspot, focalspot.com
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”