Products
MEP 6T servo electric press specializes in the application of compliant pin connectors to PCBs.
Uses a PC-controlled servo drive to control and monitor force, position and speed throughout the press cycle. By monitoring the entire press cycle, it can determine if a connector is being applied incorrectly and stop the process to avoid scrap and rework. Complete press cycle data can be stored for each connector applied to provide full traceability for the entire PCB.
Programming is provided through a Windows interface with database-driven software. Each connector can be pressed to a different level of force or distance without any operator setup.
Connectors can be terminated on force or distance while providing control of the speed of the press cycle, including the ability to dwell for a specified time. Can be used in applications other than press-fit connectors such as PEM nuts, rivets and heat sinks.
Provides up to 6 tons of pressing capacity, can accommodate PCBs up to 24 x 36". The 10" wide press ram allows for the mass-termination of more than one connector (of the same type) in a single press stroke. Options include an air table to allow for easy PCB movement and tooling stack up, tool-in-place sensor to ensure proper tool location and complete turnkey solutions including insertion tooling and PCB fixtures.
Tyco Electronics, tycoelectronics.com
Booth 1029
Uses a PC-controlled servo drive to control and monitor force, position and speed throughout the press cycle. By monitoring the entire press cycle, it can determine if a connector is being applied incorrectly and stop the process to avoid scrap and rework. Complete press cycle data can be stored for each connector applied to provide full traceability for the entire PCB.
Programming is provided through a Windows interface with database-driven software. Each connector can be pressed to a different level of force or distance without any operator setup.
Connectors can be terminated on force or distance while providing control of the speed of the press cycle, including the ability to dwell for a specified time. Can be used in applications other than press-fit connectors such as PEM nuts, rivets and heat sinks.
Provides up to 6 tons of pressing capacity, can accommodate PCBs up to 24 x 36". The 10" wide press ram allows for the mass-termination of more than one connector (of the same type) in a single press stroke. Options include an air table to allow for easy PCB movement and tooling stack up, tool-in-place sensor to ensure proper tool location and complete turnkey solutions including insertion tooling and PCB fixtures.
Tyco Electronics, tycoelectronics.com
Booth 1029
The Commercial Products division of Branson introduces support racks for the bottom of the ultrasonic tank. Parts baskets are required to suspend items in the solution, however they are not practical for all ultrasonic cleaning applications. Support racks provide a stable, flat surface upon which parts, fixtures, or containers may be placed. Open design with integral rubberized “feet” will not inhibit chemistry circulation or ultrasonic energy.
Also useful as countertop support racks following cleaning or processing. Hold containers or components off the table to facilitate air circulation and drying. A range of sizes is provided to access the full volume of your tank. Have stainless construction for chemical compatibility, electro-welded design for durability, bright electro polished finish for cleanliness. For use with .5 to 5.5 gal units.
Branson Ultrasonics Corp., bransonic.com
Also useful as countertop support racks following cleaning or processing. Hold containers or components off the table to facilitate air circulation and drying. A range of sizes is provided to access the full volume of your tank. Have stainless construction for chemical compatibility, electro-welded design for durability, bright electro polished finish for cleanliness. For use with .5 to 5.5 gal units.
Branson Ultrasonics Corp., bransonic.com
Until now, optical chips have been cut out of a silicon wafer and then placed individually into housings. However, the dimensions of these casings are several times the size of the chip itself.
Schott’s Thin-Glass Wafer-Level-Package with BGA on the backside concept aims to manufacture miniature opto-housings.
Instead of packaging individual chips, the technique “packs“ the more than 1000 chips that the entire wafer yields at the same time.
Production started at the Electronic Packaging business unit in Singapore last October. The company aims to manufacture approx. 3 million chips per month with its staff of 65 employees.
SCHOTT North America, us.schott.com
Schott’s Thin-Glass Wafer-Level-Package with BGA on the backside concept aims to manufacture miniature opto-housings.
Instead of packaging individual chips, the technique “packs“ the more than 1000 chips that the entire wafer yields at the same time.
Production started at the Electronic Packaging business unit in Singapore last October. The company aims to manufacture approx. 3 million chips per month with its staff of 65 employees.
SCHOTT North America, us.schott.com
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”