Products
Vishay Intertechnology has introduced the DLA 04051 series of vPolyTan polymer surface-mount chip capacitors, engineered to meet Defense Logistics Agency 04051 specifications for aerospace, military, and space systems. Feature ultra-low ESR down to 25 mΩ, enabling improved performance in power supplies, radars, radios, transponders and energy storage modules. Offers capacitance values ranging from 4.7 μF to 680 μF and voltage ratings from 2.5 V to 63 V. Long-term reliability is validated through 2000 hours of testing at 125 °C, while mechanical performance includes 500 g shock resistance, MIL-STD-202-204 Level D vibration compliance and 10 thermal shock cycles per MIL-STD-202-107. As a second-source alternative to Yageo/Kemet components, the DLA 04051 series provides design assurance and supply chain security for mission-critical AMS applications. Samples and production units are available with 35-week lead times, starting at $1.50 per unit for U.S. deliveries.
Dymax has introduced 9773, a ruggedizing and staking adhesive engineered to secure and protect components on printed circuit boards used in satellites, missiles and other space-based systems. The material is certified to NASA ASTM E595 Low Outgassing and Mil-Std 883 Method 5011 Low Ionic Content standards. Offers on-demand UV/visible light curing, which speeds processing and increases throughput by eliminating delays associated with traditional two-part epoxies. It is non-slumping for up to 72 hours on vertical surfaces and is compatible with jet dispensing, making it well-suited for ruggedizing, staking, or encapsulating PCB components. With a one-part, solvent-free and halogen-free formulation, Dymax 9773 also supports sustainability goals while delivering high performance.
Yamaha Robotics has introduced its latest LM placement head, engineered to extend the capabilities of surface-mount machines to handle today’s larger, heavier, and more complex components. The LM head combines enhanced hardware and software features, including extended R-axis and Z-axis control, high-precision placement-force management up to 100N and advanced landing detection, to support accurate alignment and insertion of bulky components such as high pin-count press-fit connectors. A redesigned gripping section and a new suite of interchangeable nozzles allow secure handling of oversized ICs, DIMM sockets and other non-standard parts, while compatibility with existing nozzles ensures seamless placement of standard SMD, SOP, and QFP devices.
Press Releases
- ViTrox Americas Appoints ArgoZeta as Sales Partner for the Mid-Atlantic Region
- Altus Group Expands Service Team with Addition of Experienced Engineer
- Jade Micron Pte Ltd Purchases Fourth Hentec Industries Solderability Testing Machine
- Promex and QP Technologies Appoint Ben Mendoza Vice President of Military Projects