Summit LT150 is for rework of large, high-density electronic assemblies and next-generation components. Supports components up to 150mm. Large field-of-view vision system with full-component visibility. Scaled top and bottom heating with dual PID control. Supports board sizes up to 24×36in, with optional larger formats. Increased clearance for tall connectors, heat sinks, and power modules. Designed to maintain uniform thermal performance while reducing thermal stress.