Products
The OE in a Box Full Process Kit and OE in a Box High Density Kit are designed to help electronics manufacturers generate IPC J-STD-001 objective evidence and qualify assembly processes for electrochemical reliability. Include test cards, taped-and-reeled components, SIR testing services and certificates of compliance upon successful completion. Supports qualification of top- and bottom-side SMT assemblies, multiple soldering methods and conformal coating processes.
EmberX is a software control package for TM Soldering Solutions' PHOENIX selective soldering platforms, providing programming, process control and monitoring capabilities for both manual and inline systems. Designed to simplify selective solder programming while supporting operators, process engineers and production personnel. Features integrated visual programming, onboard PCB image capture, HD video monitoring, customizable data collection and automated process validation tools, including wave height verification, nitrogen quality analysis and closed-loop preheating. Additional capabilities include maintenance tracking, fiducial and skew correction, panelized board support and expanded process parameter editing to reduce setup time and improve production consistency.
The Auto Kitting Station automates the tape reel loading process for feeders used in SMT production, reducing reliance on manual labor during production preparation. Designed for integration with Fuji's NXTR A placement machines, Smart Storage system, AMRs and automated warehouses, the unit automates reel removal, reel ID reading, tape preprocessing and feeder loading.
Press Releases
- Green Circuits Names Adam Szychowski Chief Revenue Officer
- MicroCare Appoints Doug Kay as Director of Market and New Business Development
- Altus Group Expands Soldering Portfolio with SEHO Partnership
- Seika Machinery to Kick Off SMI 2026 Webinar Series with Focus on Solder Paste Preparation and Control