Products
TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.
630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.
Electrovert EcoWave wave soldering option designed to enhance solder performance, reduce dross formation and extend maintenance intervals in electronics assembly operations. Patented single-wave nozzle integrates DwellFlex 4.0 adjustable contact length and Auto Exit Wing defect-mitigation technologies to improve wave stability and process consistency. Nitrogen-directed wave-forming design minimizes oxidation, with reported dross reductions exceeding 50% and reaching up to 75% in some applications. System maintains solder above liquidus throughout the contact sequence to improve plated-through-hole fill and joint integrity without increasing nitrogen consumption. Design reduces mechanical complexity and dross accumulation, with manufacturers reporting maintenance interval extensions of up to 93%.
Press Releases
- ASE CEO Tien Wu to Keynote IEEE ECTC 2026 in Orlando
- Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc. a subsidiary of Blackstone Global, Across the United States and Canada
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- Global Tablet Shipments Decline 3% QoQ in Q4 2025 as Market Matures