Products
Low-silver wire solder series supports manual and automated soldering applications with reduced silver dependency. The system features 0.1–0.3% Ag content and anti-iron tip erosion properties to extend soldering tip life. Designed to support improved wettability and solder flow, with reduced bridging under challenging conditions. Flux system enables consistent coverage with residues designed for simplified cleaning. Suitable for robotic soldering applications and integration into automated assembly processes. Intended for electronics manufacturing environments seeking cost control while maintaining process stability.
Low-silver solder paste series supports SMT assembly with reduced material cost exposure while maintaining process compatibility. The system features ~0.1–1.1% Ag content compared to ~3.0% in SAC305, enabling lower silver usage. Designed for compatibility with standard SAC305 reflow profiles, minimizing requalification requirements in existing processes. Supports stable wetting performance and controlled voiding behavior, with reliability validated through thermal cycling and mechanical testing. Intended for cost-sensitive SMT applications requiring consistent process performance and long-term reliability.
Wafer inspection and metrology platform supports advanced packaging and back-end semiconductor processes. The system accommodates 6" to 12" wafers and integrates automated visual inspection for detection of particles, scratches, chipping, contamination and foreign materials. Granite-based structure supports system stability, with optional short-wave infrared module enabling detection of subsurface defects within silicon. 3D depth-from-focus module offers imaging at 0.5µm or 1µm resolution for detailed surface analysis. Platform performs metrology for wafer thickness, top-side warpage and surface topography, along with measurement of through-silicon via depth, trench dimensions, thin films and chiplet features. Designed for inspection and measurement applications across advanced packaging workflows.
Press Releases
- Adam Ryder appointed as Managing Director of Incap UK
- Metal Etch Services Opens New Motor City Facility to Meet Growing Midwest Demand
- Yamaha surface-mount line powers the future of specialized production at Inter-Company in Netherlands
- Matric Group Becomes the First U.S. Manufacturer to Deploy Panasonic NPM-GH Dual Lane SMT Technology