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Vision Engineering ProteQ VISO 3-D digital stereo microscope features fully integrated autostereo display.

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Shenmao PF606-P279L ultra-fine pitch solder paste is for mini-LED manufacturing.

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Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.

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