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Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-friendly interface said to reduce the load and improving operator efficiency.

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Shenamo PF925 near-eutectic solder is said to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics.

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Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.

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