Products
NuSil Technology, a manufacturer of silicone-based materials for military, aerospace, electronics and photonics, has expanded its line of electronic packaging materials (EPMs).
All materials in this line will have low outgassing properties to prevent contamination. They have undergone extensive processing and maintain weight losses of less than 1% after exposure to temperatures exceeding 275°C for one hour. Other materials used in this industry are said to exhibit weight losses four to five times that of the NuSil materials.
Among the new offerings are potting and encapsulating materials; static-dissipative and glop top materials; dielectric gels; and thermal interface materials (TIMs), which come in grease, adhesive and gel forms.
All materials in this line will have low outgassing properties to prevent contamination. They have undergone extensive processing and maintain weight losses of less than 1% after exposure to temperatures exceeding 275°C for one hour. Other materials used in this industry are said to exhibit weight losses four to five times that of the NuSil materials.
Among the new offerings are potting and encapsulating materials; static-dissipative and glop top materials; dielectric gels; and thermal interface materials (TIMs), which come in grease, adhesive and gel forms.
NuSil Technology, www.nusil.com
VISULA 8 features three core areas of improvement: layout, library tools and CAM tools. Layout developments include enhancements to functionality associated with the use of starpoint components, which can now be simply added to a design. Thermal relief on vias has been extended to allow relief at 45-degrees as well as the existing 90-degree setting. Other layout features include allowing the user to display areas of different types using different colors, introduction of a 'necked width violations' report, identification of component pads that violate via keep-out areas supported by batch and interactive checking and the option of coloring trunk* items within the design.
Users can now print using the standard Windows printing dialog in the Databook Designer, in addition to the PostScript printing option. Tabular display option makes adding gate suffixes to elements within the Library Editor much simpler. Search results from the Library Searcher can also be output in CSV format.
Use of CAM tools allows the employment of standard page sizes for printing PDF outputs, and the user can specify the default plot file extension for post-processing output files in their MDF database.
Version 8 is free of charge for all current customers with a maintenance agreement.
Users can now print using the standard Windows printing dialog in the Databook Designer, in addition to the PostScript printing option. Tabular display option makes adding gate suffixes to elements within the Library Editor much simpler. Search results from the Library Searcher can also be output in CSV format.
Use of CAM tools allows the employment of standard page sizes for printing PDF outputs, and the user can specify the default plot file extension for post-processing output files in their MDF database.
Version 8 is free of charge for all current customers with a maintenance agreement.
Zuken, www.zuken.com
TherMoire PS200 lab tool is the result of customer feedback and changing industry needs. The new JEDEC standard for temperature-dependent warpage measurement of packages (JESD22B112) now requires faster heating and cooling rates, and this tool delivers improvements in both. Allows the user to more precisely replicate a temperature profile, while taking real-time flatness measurements. New ergonomic design and better user interface improve ease-of-use.
LineMoire PS16 is a room-temperature flatness measurement system, designed for both QA/QC and high-volume production settings. Capable of both package and PCB flatness measurements. Can measure global and local area warpage with a 1 sec. data acquisition time.
AkroMetrix, akrometrix.com
Booth 1451
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