MicroLine 350Ci laser system offers stress-free depaneling of assembled PCBs. Uses a laser technology featuring higher cutting speeds then mechanical depaneling methods and requires no expensive artwork related tooling.
 
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
 
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.