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Crossbow connector platform features Crossbow Matrix for orthogonal midplane architectures and Crossbow 2mm+ for standard backplane configurations. The differential connector is optimized for orthogonal midplane configurations, and enables data rates up to 25 Gb/s.

The connector is designed so the differential pairs on each side of the midplane share vias. This direct path approach and the connector's footprint eliminates most electrical problems associated with the traditional backplane via stub, including elimination of cross-talk in the footprint, reflections and impedance mismatches. Said to reduce board layer count by as much as 50% and eliminate the need for backdrilling.

Exhibits less than 0.6% crosstalk at 50 ps and 25 db below transmission across the entire link (past 10GHz). It also demonstrates 100+/- 5% ohms matched impedance across a full link and includes features that compensate for skew.

The 2mm+ connector supports 12.5 Gb/s data rates in a high-density (63 pair/in) configuration. Demonstrates crosstalk less than 1.5% at 50 ps and is designed to complement Crossbow Matrix. Both versions fit on the same rear organizing stiffener, allowing designers to configure a single connector to support orthogonal midplane connections and route high-speed signal lines across the backplane in hybrid architectures.

Incorporates the GbX (R) 0.018" compliant pin and mating interface to ensure mechanical robustness. Both connectors include unique features on the backplane modules that reduce the potential for bent pins.

The Matrix platform includes a 6 x 6 (differential pairs) and 4 x 4 version. The 2mm+ features five differential pairs per column. Both connectors include power and guidance.

Amphenol TCS

ASYS introduced a laser marking island during Apex. The island consists of a Board Destacker, Laser Marker, an optional Flip Station and a Restacker. Can handle a throughput of up to 510 PCBs per hour including code verification. The optional Flip Station, which is completely controlled by the laser marker, can flip the boards for double-sided marking requirements. The marker can handle all industry standard 1-D and 2-D codes, text and graphics in a maximum range of 18 x 18”. The island is less than 8.5 feet long and can be upgraded with multiple options.

ASYS Automation, asys-llc.com

The Christopher Group has introduced the DaiNippon Screen (Kyoto, Japan) FP 8000 final visual inspection system. Using DaiNippon Screen’s advanced color imaging system, it inspects both sides of the substrate automatically for surface defects including scratches, chips, exposed metal surfaces, discoloration, solder mask on pads, and other surface defects. Can inspect gold, copper, solder mask and legend ink, as well as the underlying patterns. Substrates with multiple surface finishes can also be inspected.

Image capture and processing speed is up to 200% faster than previous models with an inspection time of less than 30 sec. for both sides of an 18 x 20” substrate. Is fully automatic, and programming is simple. Has Windows XP user interface, can be linked to the VS Series verification stations.

The Christopher Group Inc., christopherweb.com