BP Win 4.58 offers support for very small package (VSP) devices.
Offered exclusively on BP Win Automated Programming Systems, support for VSP devices currently includes MSOP8, TSOC6, and the smallest device, SOT23, with dimensions of 1.63 x 2.95 mm. Other VSP devices may be supported by entering a device request through BP Micro’s web page.
Modifications to the software allowed the use of the existing CyberOptics laser alignment vision system to accurately pick and place VSP devices without degradations to system throughput.
Today’s highly flexible, fast SMT placement machines are designed for just-in-time manufacturing; they can run multiple jobs at once, have 300 or more ‘smart’ feeders loaded at any time with the entire range of components from 0201s up to 55 x 55 mm at high speeds. As feeders index components for pick up and placement, repeatable accuracy is critical. CeTaQ announces the availability of a machine Capability Analysis (MCA) service that verifies feeder and shuttle motion repeatability.
Michael Sivigny, general manager, said, “One of the consequences of the move to lead-free assembly is less tolerance for even slight variations in placement accuracy. Components do not self-center as easily during reflow with lead-free solders. Consequently, placement accuracy is more important than ever. While there are other aspects of pick and place machine accuracy addressed by our services, this approach specifically addresses issues with feeders. Our feeder calibration service is critical to ensure repeatability of pick location, feeder indexing, component location, and sprocket repeatability. This is of particular importance for handling components such as tiny 0201 and 01005 chips.”
CeTaQ’s service involves the use of a ‘smart’ camera that works in conjunction with its mobile metrology system. Additionally, the service dovetails with a feeder maintenance program designed to ensure continued accuracy once feeder accuracy and repeatability issues have been corrected. The service and methodology can also be applied to die feeders and picked die from cutting.
TREK StandAlone Wash Module is a SMEMA compatible module that can interface with any existing conveyorized inline washer, regardless of manufacturer.
The module provides chemistry cleaning capability to an existing cleaner that may not support a chemical wash process, or may have poor chemical isolation. Ideal for manufacturers faced with conversion to Pb-free soldering processes where chemistry cleaning is required, but not supported by the current washer. Provides a heated recirculated spray wash in addition to chemical isolation, turning any
washer into a chemistry compatible cleaning system. Can be optioned with Liquid Lock technology, which reportedly reduces consumption of cleaning solution and power. By sealing the wash zone with an entry and exit laminar flow of fluid, ittraps the atomized spray in the wash chamber, essentially eliminating atomized spray mist exhaust.
Options include: presoak stage, filtration, automatic chemical injection, top belt and various levels of spray pump performance packages.