Products
nanotom is a high resolution computed tomography x-ray analysis system in a compact package. The 160 kV nanofocus computed tomography system is tailored for the special needs of material science, micro mechanics, electronics and biological applications.
The compact system consists of a granite based CT-construction with a 160 kV high-power nanofocus x-ray tube and a special digital detector to reach a voxel resolution of < 500 nm. The fully digital detector has 5 Megapixel resolution and a measurement range expansion for the highest possible resolution.
Can examine samples with diameters up to 120 mm (4.7”) and a weight up to 1 kg (2.2 pounds). Special door construction and advanced sample fixture permit simple, precise positioning of the samples.
Comes with CT-software, datos|x. This software offers easy, intuitive operation and requires minimal training. An available PC cluster further reduces reconstruction times.
Suitable for the 3-D examination of sensors, complex mechatronic samples, micro electronic components and material samples in every type like synthetic materials, ceramics, composite materials, rock samples and more.
phoenix|x-ray Systems + Services Inc., phoenix-xray.com
The compact system consists of a granite based CT-construction with a 160 kV high-power nanofocus x-ray tube and a special digital detector to reach a voxel resolution of < 500 nm. The fully digital detector has 5 Megapixel resolution and a measurement range expansion for the highest possible resolution.
Can examine samples with diameters up to 120 mm (4.7”) and a weight up to 1 kg (2.2 pounds). Special door construction and advanced sample fixture permit simple, precise positioning of the samples.
Comes with CT-software, datos|x. This software offers easy, intuitive operation and requires minimal training. An available PC cluster further reduces reconstruction times.
Suitable for the 3-D examination of sensors, complex mechatronic samples, micro electronic components and material samples in every type like synthetic materials, ceramics, composite materials, rock samples and more.
phoenix|x-ray Systems + Services Inc., phoenix-xray.com
EP76M is a two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive. Has a one to one mix ratio by weight or volume. Has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. Thermal conductivity is 8-9 BTU/in/ft²/hr/°F. Readily develops a tensile shear strength of 2,000 psi when measured and cured at room temperature.
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
Master Bond Inc., www.masterbond.com
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
Master Bond Inc., www.masterbond.com
A new ProLINE-RoadRunner in-line programming solution is configured specifically for Siemens X-Series placement machines.
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
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