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Products

Kester’s Apex booth will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Featured products include: EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure K100 lead-free bar solder alloy, along with  technical services to help manufacturers assemble Pb-free. An interconnecting materials catalog will be debuted.

Kester, kester.com
Apex booth 1085
VectraElite soldering system will make its North American debut at Apex. It expands on the core subsystems of the Vectra wave soldering system.  In addition to improved system wide access, a new rollout solder pot design and an advanced control system, it features UltraFill nozzles, upper High Velocity Convection (HVC) preheat module and a ServoJet fluxing system. 

The company will also preview its Post Wave Cooling (PWC) module and the Optima ultrasonic spray fluxing system featuring Ultra-Spray technology.

Speedline will also preview new options for its MPM Accela printing system as well as spotlight an array of its MPM printing, Camalot dispensing, and Electrovert soldering and cleaning solutions.
 
Speedline Technologies, speedlinetech.com
Apex booth 1207

SFX-TAP4/CR is the newest member of Scanflex TAP transceivers, developed for integration in Flying Probe Testers (FPT) offering four parallel independent TAP.
 
This seventh TAP transceiver can be freely combined with all Scanflex controllers on PCI, PXI, USB or LAN basis, with distances up to five meters. Each TAP offers programmable input and output impedance, stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz, programmable delay compensation, read-back of output signals and a relay controlled power signal. This enables an optimal UUT configuration over distances up to 1.5 m. Feature captive CION interface chips (ASIC) and additional safety measures. Features 32 voltage-programmable dynamic I/O, two analog I/O channels, three statistic I/O and trigger lines.
 
All TAP signals and PIO channels are galvanically isolated from the UUT, and can be tested for operation directly in the system by means of an integrated Built-In-Test (BIT).
 
The transceiver has a particular slot for coupling with Scanflex I/O modules; or various SFX I/O modules can be connected via an SFX/LS interface.
 
Supported by software System Cascon from version 4.2.1 on and is compliant with standards IEEE 1149.1, IEEE 1149.4, IEEE 1149.6, IEEE 1532 and JESD71. The software automatically recognizes the transceiver by the AutoDetect Feature. 
 
GÖPEL electronic, www.goepel.com

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