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Keithley Instruments announces two new additions to its Series 2600 System SourceMeter instruments. Models 2611 and 2612 add higher voltage and higher current capabilities to the source-measure unit (SMU) platform. The 200V and 10A capabilities of the two new models make them ideal for functional test and I-V characterization of silicon and compound semiconductor devices like FETs, diodes, voltage regulators and optoelectronic components. Combine high throughput SMU technology with a compact, scalable form factor that allows integration into systems from one to 16 SMU channels.
 
Designed to rapidly test low to medium pin count devices or multiple devices in a production test fixture. Model 2611 is a single-channel SMU, and the Model 2612 is a dual-channel unit. Multiple units can be integrated with an embedded Test Script Processor (TSP) and TSP-Link. Users cam execute high-speed, automated test sequences across multiple channels, independent of a PC operating system and its associated communication delays. This allows test speeds up to ten times faster than conventional test instruments. With two channels and a 200V source range, Model 2612 is capable of 400V differential operation, and each SMU channel is capable of 1.5A DC and 10A pulsed output. Both models have a new contact check feature that eliminates false failures in high-speed test applications by ensuring that all connections to the devices under test are intact before a source-measure sequence is initiated.
 
Keithley Instruments, keithley.com
Best has installed a new C02 Laser for customized rework applications. The system gives further capabilities for precision marking, drilling, scoring and organic material cleaning of electronic PCB materials. Marking applications include inscribing PCB laminates, semiconductor devices, sires, glass diodes and coated metal surfaces with letters, numbers, symbols and bar codes. Can precisely define new pads and traces, and etch off solder mask patterns to a few mils. Organic materials such as flux residues and contamination can be ablated off the surface of the board. Polyimide can be cut into various shapes for customized wave solder masking applications.
 
Rework stencil deliveries can now be compressed to five standard and 24-48 hrs on an expedited basis. StencilQuik rework stencils stay-in-place polyimide stencils speed up the BGA placement and rework process.
 
The custom-built laser micromachining system has a range of capabilities. Its source is a 9.3-micron C02 laser galvanometer based beam delivery system. Feature sizes down to 150 microns are possible. Materials including plastics, glass, wood, thin films and other organic materials can be processed using AUTOCAD and other file types as the templates.
 
Business Electronics Soldering Technologies (Best), solder.net
S300 diamond blade depaneling saw singulates assembled PCBs. Saw blade is a 2.95" diameter, .021" thick cutting blade.
 
Provides a stress-free method to singulate panels with sensitive surface-mount components close to the edge of the parting section, leaves a smooth edge finish with minimal stress  imparted to the PCB. Can also be used to singulate PCBs without scorelines, or to singulate PCBs with overhanging components on the parting line. Since the cutting depth can be set to just cut through the PCB itself, any components which overhang the parting line will remain intact. The working area of the saws are covered by a plexiglass enclosures.
 
The automatic, microprocessor-controlled, multiple-blade saw can be used for singulating side handling strips from DC/DC  converters or SIMM cards. An operator places up to five panels at one time into the input tray of the xy table. Pushing the start button activates the microprocessor-controlled process to bring the PCB past the saw blades to the offload position.  Up to eight blades can be set on a mandrell to cut multiple panels in one pass.
 
FKN Systek, Fknsystek.com

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