Products
A full range of precious metal clad products for fabricating micro-switches, connectors and components used in high-reliability medical, military and consumer products is available from Anomet.
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
Micro HVR addresses the high-volume rework market where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder. All steps are automated.
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
IBIS, the Interferometric Bump Inspection System, offers production volume solder bump inspection on chip carriers. It inspects and reports on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that carriers are within specification for chip attachment.
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”