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ALPHA EF-6100 low-solids wave solder flux is the latest addition to Cookson’s EF-Series environmentally-friendly fluxes designed for Pb-free as well as SnPb processes. The no-clean, alcohol-based flux passes all international reliability standards including IPC, Bellcore and JIS.
 
Leaves minimal colorless, non-tacky, clear  flux residue that spreads uniformly over the surface of PCBs. Provides resistance to connector bridging across a range of process conditions. It is compatible with all common pad finish types and improves yield by reducing defects, minimizing rework and increasing throughput.
 
Cookson Electronics Assembly Materials, cooksonelectronics.com
Servo-Flo 404 System is a compact shot meter and integrated dispense valve for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The positive rod displacement and servo-motor design can dispense abrasive and filled adhesives and sealants such as epoxies, silicones and urethanes.
 
Has a quick-change Tip-Seal dispense valve for accurate start-stop of material flow. Can be mounted to a robot wrist, moving automation or fixed mounted. System design selections include volume size, temperature control, valve selection, vision and system integration.
 
Closed-loop processor provides precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
 
Sealant Equipment & Engineering, sealantequipment.com

Self-Cleaning Squeegee system was showcased at the IPC Innovative Product Showcase during Apex.  A panel chose 10 products out of 556 entrants.    
 
Both Pb-free and traditional solder paste printing processes exhibit a high degree of solder paste sticking. This produces undesirable affects, such as paste bleeding defects, premature contamination of the stencil surface and requirement for more cleaning interruption.  Process cycle time is affected negatively as the paste requires time to drop off the squeegee after each print stroke. 
 
The Permalex Paste Manager achieves lower overall sticking compared to normal dual squeegees, and the system reduces the migration of solder paste within the print area. 
 
Reportedly offer improved printing in Pb-free environments.  
 
Transition Automation, www.transitionautomation.com

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