PRO 1S and PRO 1Sm are single nozzle, selective soldering stations that solder components individually or in groups. The nozzle is surrounded by a nitrogen blanket.
The 30-lb. solder pot is Pb-free compliant and comes with a solder replenishment system and automatic spray fluxer system. PCBs or pallets enter the work cell on an in-line conveyor system. Programs may be set up through a data management system or overhead laser pointer. Once the x/y parameters are established, the z motion can maneuver around bottom-side components.
PRO-8b Selective Laser Soldering system provides an economical means to selective solder tin/lead and Pb-free alloys within minimal startup costs and ongoing maintenance, lower power consumption, and reduced environmental impact.
60-W Diode Laser Cell in-line soldering station combines easy-to-use software and precision movement to selective solder most bottom-side applications. Offers over 10,000 hours of useful soldering life and does not require that the solder remain preheated during non-soldering times. Equipped with a precision four-axis Cartesian robot with enhanced Adept motion and vision guidance (with fiducial recognition system and dynamic compensation). End effector allows the soldering head and automatic solder feeder to be independently adjustable. Variable beam selection ranges from 0.7 to 2.5 mm. Approach and angle are controlled through software.
Pin-to-pin acceleration can be as aggressive as 0.1 sec. Can move 1.2 meter/sec. at 1G acceleration; however, most soldering is accomplished at 50% of this level. The vision system may be programmed to look for known fiducial points, analyze them and automatically center to that point. Variable beam size allows operators to program in desired size (from 0.7 to 2.5 mm.
SMT USC400 is a portable ultrasonic contact type stencil cleaning system.
The operator moves the hand tool over the stencil after spraying with cleaning fluid. The tranducer vibrates the contamination through even small stencil apertures. Residues are collected on disposable wipe material under the stencil. Removes difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame.
An optional ultrasonic mini-bath is available to clean machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Is lightweight, has rugged industrial construction and is suitable for all stencil materials, even plastic. Suitable for all printable materials, including paste, inks, resists and SMD adhesives. Advanced Transducer Autotuning system results in optimum cleaning performance.