Products
EP76M is a two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive. Has a one to one mix ratio by weight or volume. Has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. Thermal conductivity is 8-9 BTU/in/ft²/hr/°F. Readily develops a tensile shear strength of 2,000 psi when measured and cured at room temperature.
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
Master Bond Inc., www.masterbond.com
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
Master Bond Inc., www.masterbond.com
A new ProLINE-RoadRunner in-line programming solution is configured specifically for Siemens X-Series placement machines.
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Concept FX is a multi-axis, x-ray inspection system featuring configuration flexibility with 80/90/130 kV x-ray source options, six axes of motion control, operator-friendly ergonomic design and a no-clamp sample tray for fast load and unload.
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
Focalspot,.focalspot.com
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