FLIP Solder Bath for Pb-free reflow soldering features Linear Induction Pumping, in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, which moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in reflow and selective solder systems.
Uses 300 kg of solder, instead of 450 kg, and generates less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. Offers open space to access inside side bath and easy nozzle cleaning and maintenance. Does not have motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types.
Model 1800A adds a motor-controlled board support table to facilitate automated, hands-free site scavenging on the Summit 1800 rework system. Supports automated alignment and reduces operator intervention. Options include component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
Has Windows-based SierraMate 7.0 software with Advanced Auto Profile for rules-based process development.
Automatic prism shuttle facilitates accurate and repeatable component alignment. Simultaneously looks up at the component and down at the board, providing a composite alignment view. Digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a click on the GUI.
Incorporates independent, programmable motions for pick-up and top heater height. Pick-up motion allows placement force control and zero force removal. Component pick-up tube features 360° Theta control and automatic alignment height. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board.
Features standard board handling of 18 x 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40X.
Champion 6809 is a servo-driven, automated dispensing system for precision processes. Has easy-to-use proprietary software and GUI that allows for intuitive programming and control. Includes a large, bright, high-contrast color TFT display. Can be configured to match application requirements from dots to underfills. Placement accuarcy is within 3 µm.
Dispenses dot diameters to 0.003" with bead width down to 0.003". Volumes are below 0.5 nanoliters. Dispense area is 5.5 x 12.0", with resolution and repeatability of ±0.00008" (2 μm) for all axes.
True Volume Piston Positive Displacement Pump can fire up to 90,000 precision deposits/hr. to form high-definition dots, lines, fills and builds. Volume repeatability is 1.7%, 3 Sigma. Uses true positive displacement without the use of augers and pump motors to prevent maintenance problems. Good for placing Pb-free material.