Products
A new line of Pb-free no-clean solder pastes was introduced by the Contact Materials Division (CMD) of Heraeus during Apex last week. The F640 Series is said to promote wetting and minimize defects with tin/silver/copper alloy soldering.
With a wide process window, the paste is able to compensate for process variations in printing, component placement and soldering. Provide wetting on a variety of surfaces and finishes, and leave behind a clear residue. Offer minimal slumping and exceptional print-to-print consistency, can also be reflowed in air or nitrogen environments.
Heraeus, 4cmd.com
S-50 System 10:1 ratio cartridges are available for the Mixpac Hand-Held Cartridge Dispensing System. The system consists of a manual dispensing gun, a cartridge and a static mixer.
Cartridges are used to dispense two-component adhesives in a 10:1 volumetric ratio. The total capacity of each cartridge is 50 ml and they are available in either polypropylene or polyester. Offers precise ratio control and reduction in hazardous material waste.
ConProTec Inc., conprotec.com
Cartridges are used to dispense two-component adhesives in a 10:1 volumetric ratio. The total capacity of each cartridge is 50 ml and they are available in either polypropylene or polyester. Offers precise ratio control and reduction in hazardous material waste.
ConProTec Inc., conprotec.com
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with CSP lead pitches of 0.5 mm and 0.4 mm. As lead-free manufacturing becomes the norm, the ability to reliably process finer pitched devices within Pb-free parameters will be vital.
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance. Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection .
Classified as ROL0 to ANSI/J-STD-004.
Henkel, electronics.henkel.com
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance. Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection .
Classified as ROL0 to ANSI/J-STD-004.
Henkel, electronics.henkel.com
Press Releases
- StenTech Strengthens Precision Parts Platform with AME Acquisition
- Count On Tools Enhances Selective Soldering Precision with Expanded Nozzle Lineup
- ViTrox Presents Advanced Inspection and Smart Manufacturing Solutions at NEPCON Asia 2025
- ASC Sunstone Circuits Adds New Options to OneQuote While Maintaining Real-Time Pricing on Core PCB Features