Products
M-Series range of mid- to high-volume SMD placers now includes the MG-2 chipshooter. It will be launched at booth 2117 during Apex.
Said to provide high-speed, high-mix, high-accuracy production for applications such as automotive, memory boards and PC peripherals. Can be used alone to deliver chipshooting speeds up to 40k cph. Or it can be used with the MG-1 and/or MG-8 multifunctional machines to boost line performance in applications requiring additional chipshooting capacity.
Features a high-precision dual-gantry system carrying four beams, each with six heads. Places components from 01005 to CSP, BGA, PLCC and QFP with a maximum size of 14 sq. mm, with placing accuracy of 50 micron at 3 sigma for chips.
Benefits include a small footprint and functional flexibility. Uses the same user interface, feeders, feeder trolleys and spare parts as the MG-1 and MG-8 and GEM XII range.
Accepts 96 smart feeders and accommodates tape, stick and bulk feeders. Smart feeders are equipped with the latest RFID technology to enable fast, easy machine set-up and provide a real-time component inventory check.
Assembléon, assembleon.com
Said to provide high-speed, high-mix, high-accuracy production for applications such as automotive, memory boards and PC peripherals. Can be used alone to deliver chipshooting speeds up to 40k cph. Or it can be used with the MG-1 and/or MG-8 multifunctional machines to boost line performance in applications requiring additional chipshooting capacity.
Features a high-precision dual-gantry system carrying four beams, each with six heads. Places components from 01005 to CSP, BGA, PLCC and QFP with a maximum size of 14 sq. mm, with placing accuracy of 50 micron at 3 sigma for chips.
Benefits include a small footprint and functional flexibility. Uses the same user interface, feeders, feeder trolleys and spare parts as the MG-1 and MG-8 and GEM XII range.
Accepts 96 smart feeders and accommodates tape, stick and bulk feeders. Smart feeders are equipped with the latest RFID technology to enable fast, easy machine set-up and provide a real-time component inventory check.
Assembléon, assembleon.com
PRO 1Tc selective soldering robot includes two iron tip soldering heads on a single soldering head platform. Is an inline handling, top-side selective soldering station designed to selective solder two points at the same time. When products can be aligned within a pallet in a symmetrical manner, it can solder two joints simultaneously, thus reducing cycle time.
Features “One Touch” pennant controller, dual iron tips and dual automatic solder feeders, 90 W power supply, precision x/y motion control platform, controllable z axis, fume extraction port, overhead lighting, process viewing camera and many auto detection features.
Promation, Pro-mation-Inc.com
Lasers used in precision micromachining and manufacturing of medical devices and biomedical products such as tissue-growing scaffolds, cell sorters and microfluidics must make precise cuts, often within the micron tolerance range.
CeTaQ Americas’ Machine Capability Analysis (MCA) testing is applicable to laser systems. The test methodology measures the width of the laser cut as well as beam size and consistency, comparing the actual result with the programmed pattern and process settings. Is applicable to lasers used in cutting, welding, and scribing, stencil cutting, laser marking (such as matrix labeling) and other applications such as drilling.
All types of lasers, including UV (excimer and DPSS) can be evaluated. In laser processing, typically the laser head is stationary, and the product is moved under the beam via high-precision air bearing stages. The test methodology verifies the X-Y accuracy of these stages and the motion control system.
MCA testing is a third-party, objective evaluation methodology in which special vision algorithms, accurate glass plates and components are utilized for independent measurement of Cp and Cpk indices on production equipment. The laser system verification process uses a transparent heat-sensitive film in conjunction with the glass plate measurement system.
CeTaQ Americas’ Machine Capability Analysis (MCA) testing is applicable to laser systems. The test methodology measures the width of the laser cut as well as beam size and consistency, comparing the actual result with the programmed pattern and process settings. Is applicable to lasers used in cutting, welding, and scribing, stencil cutting, laser marking (such as matrix labeling) and other applications such as drilling.
All types of lasers, including UV (excimer and DPSS) can be evaluated. In laser processing, typically the laser head is stationary, and the product is moved under the beam via high-precision air bearing stages. The test methodology verifies the X-Y accuracy of these stages and the motion control system.
MCA testing is a third-party, objective evaluation methodology in which special vision algorithms, accurate glass plates and components are utilized for independent measurement of Cp and Cpk indices on production equipment. The laser system verification process uses a transparent heat-sensitive film in conjunction with the glass plate measurement system.
CeTaQ America, cetaq.com
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”