Products
A hand-held X-Ray Fluorescence (XRF) NITON analyzer is equipped with a helium purging mechanism for direct analysis of “light elements.” The analyzers provide immediate chemical analysis of alloys, electronic materials, coatings, plastics and more.
NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site.
Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users.
For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site.
Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users.
For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
Thermo Electron Corp., thermo.com
SCC-700 Cooling Conveyor station provides a quick PCB cool down that occupies a minimal amount of floor space.
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
Promation, Pro-mation-Inc.com
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
Promation, Pro-mation-Inc.com
DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Hover-Davis, hoverdavis.com
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”