Products
Simple Green Stencil and Misprint Cleaner reportedly combines effective results with a high level of user and environmental safety associated with Simple Green products.
Michael Konrad, president, said, “Simple Green Stencil and Misprint Cleaner is simply the best solder paste remover we have ever seen. I have never before seen a stencil cleaning chemical clean so quickly and rinse so effortlessly.”
Is designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners and is also available in a trigger spray for manual stencil cleaning applications.
Offering lower health and safety risks than traditional solvent-based cleaners, and better cleaning efficiency than current aqueous-based cleaners, it complies with the most stringent (SCAQMD) VOC regulations when used as directed.
Aqueous Technologies Corp., aqueoustech.com
Michael Konrad, president, said, “Simple Green Stencil and Misprint Cleaner is simply the best solder paste remover we have ever seen. I have never before seen a stencil cleaning chemical clean so quickly and rinse so effortlessly.”
Is designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners and is also available in a trigger spray for manual stencil cleaning applications.
Offering lower health and safety risks than traditional solvent-based cleaners, and better cleaning efficiency than current aqueous-based cleaners, it complies with the most stringent (SCAQMD) VOC regulations when used as directed.
Aqueous Technologies Corp., aqueoustech.com
FLX500 is a self-contained, automated device programmer that fits on a desktop. The system will be introduced at Nepcon UK and Semicon Singapore next week.
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
Alphasem AG, alphasem.com
Press Releases
- Parmi Expands Mid-Atlantic Sales Coverage with Cope Assembly Products
- Seika Machinery to Host SMI 2026 Webinar Series Session 2 on PCB Slicing Methods and Low-Stress Separation
- Pillarhouse USA Expands BarTron, Inc. Sales Territory into Indiana
- Mycronic appoints Peter Andries as General Manager of MRSI Systems and VP of Global Technologies Division