Products
Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing.
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
Version 2.5 of the Environmental Material Aggregation and Reporting System (EMARS) completely supports the IPC-1752 Material Declarations standard for the RoHS directive.
"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS. Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."
EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.
Synapsis Technology, synapsistech.com
"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS. Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."
EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.
Synapsis Technology, synapsistech.com
MicroLine 350Ci laser system offers stress-free depaneling of assembled PCBs. Uses a laser technology featuring higher cutting speeds then mechanical depaneling methods and requires no expensive artwork related tooling.
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
LPKF Laser & Electronics, lpkfusa.com
Press Releases
- StenTech Strengthens Precision Parts Platform with AME Acquisition
- Count On Tools Enhances Selective Soldering Precision with Expanded Nozzle Lineup
- ViTrox Presents Advanced Inspection and Smart Manufacturing Solutions at NEPCON Asia 2025
- ASC Sunstone Circuits Adds New Options to OneQuote While Maintaining Real-Time Pricing on Core PCB Features