August 2012 cover


QFN ReworkQFN Rework
Simple, Fast High-Reliability Rework of Leadless Device
A recent NASA/DoD study of the impact of leadless device reliability after rework compares older methods such as solder paste printing the site location with newer techniques, including device pad bumping and polyimide stencil placed over the land patterns.
by Bob Wettermann

Solder Paste InspectionSolder Paste Inspection
Applying the Data
SPI machines generate huge quantities of valuable data that often go underutilized. New software-based applications, however, use the data generated during print inspection to automatically control and improve the overall SMT process.
by Chrys Shea

Talking Heads
SMTC: Sitting Pretty in San Jose
Paul Blom, executive vice president, operations at SMTC, has firm ideas about the contract assembler's focus on the Silicon Valley at a time when Tier 1 firms have downsized local operations.
by Mike Buetow

Discontinuing Use of the Machine Model for Device ESD Qualification
Long relied upon for component ESD qualification, the machine model is being rapidly discontinued, and for good reason.
by Charvaka Duvvury, Robert Ashton, Alan Righter, David Eppes, Harald Gossner, Terry Welsher and Masaki Tanaka



  • Caveat Lector
    Why Apple will revive onshoring.
    Mike Buetow



    • ROI
      "Details to follow."
      Peter Bigelow

    • Focus on Business
      Long live the King.
      Susan Mucha



  • Screen Printing
    Finely tuned.
    Clive Ashmore

  • Tech Tips
    Bottom side tombstoning.
    Robert Dervaes

  • Process Doctor
    Refractive deflected.
    Michael McCutchen

  • Test and Inspection
    Growing your talent.
    Adrian Cheong

  • Defects Database
    Side terminations.
    Dr. Chris Hunt

  • Materials World
    No more grease.
    Jie Bai

  • Technical Abstracts
    In Case You Missed It.

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