Shenmao PF606-P lead-free solder paste for use in "reverse hybrid" board assembly is compatible with existing SAC SMT materials and reflow processes.

Vishay LTO 150H resistor handles higher pulse energy for protection in high-stress environments. Absorbs up to 75J/0.1s and dissipates 150W at 45°C, with low thermal resistance for stability. Supports resistance values from 1Ω to 2.2 kΩ and operates at up to 175°C in EV, industrial, and telecom systems.Page Break

Vishay Intertechnology, Inc.

http://www.vishay.com/

CE3S Millice StripAid X series biodegradable solvent removes WaferGrip and TrueGrip adhesives. Suitable for wafer thinning, ultrasonic agitation, and high-temperature debonding. Enables safer, cleaner semiconductor processes with simplified storage.Page Break

CE3S

www.ce3s.comwww.ce3s.com

Saki Corp. 3Xi-M200 AXI now has upgraded software that improves solder joint defect detection for power modules, including those with thick baseplates and heat-dissipating finned structures.

Robotas Mascot Systems manual through-hole assembly system. Replaces axial, radial and DIP insertion machines. Features include 360° clinching, laser-guided assembly, and optional camera verification to reduce rework.Page Break

Robotas Technologies
www.robotas.com

ULT LAS 260.1 MD.14 laser fume extraction system is designed for quiet operation and energy efficiency.

Vishay Intertechnology has launched the VEML6046X00, the first AEC-Q100 qualified RGBIR color sensor comes in.Page Break

2.67 × 2.45 × 0.6mm package Inegrates photodiode, low-noise amplifier, and 16-bit ADC, enabling color temperature calculation and operation behind dark cover glass. Ambient light range up to 176 klx and a sensitivity of 0.0053 lx/ct, it ensures accurate measurements without daylight saturation. Designed for automotive applications, it supports I²C communication and operates at temperatures up to +110°C.

Vishay

http://www.vishay.com/

Count On Tools nozzles for Juki 460 Cube and Seho PowerSelective/SelectLine selective soldering machines are designed to improve solder flow and reduce maintenance.

Yamaha Robotics SMT Section YSUP-PG programming module now features automated programming capabilities said to streamline program generation for all surface-mount processes, including dispensing, printing, placement and inspection.

BEST StencilQuik is a custom stencil designed for ball grid array (BGA) and chipscale package (CSP) placement.

AGC Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes.

Cetec ERP versions 4.16, 4.17, and 4.18 include new features to streamline production, optimize inventory management, and improve communication.