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Stirri's LT-HF solder paste is said to be the world's first low-temperature halogen-free solder paste with an optical tracer.

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ViscoTec's eco-PEN XS 180 volumetric microdispenser precisely dispenses quantities as small as 0.25μL and beads as narrow as 0.1mm, depending on the material.

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ASMPT's CMAT-S is an all-in-one system for assembling and dynamically aligning lenses in ADAS cameras.

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Renishaw's RenAM 500 Ultra laser powder bed fusion (LPBF) 3-D printer incorporates new scanning algorithms that allow the laser to fire while the recoater is moving, saving up to nine seconds per build layer.

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Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.

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AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.

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Master Bond's UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.

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Tagarno's T50 digital microscope is equipped with a 4K/60FPS block camera to provide users with a seamless and lag-free viewing experience.

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Nordson Electronics Solutions' Asymtek Select Coat SL-1040 conformal coating system includes system-level advancements to elevate automation, control, precision and preventive maintenance for better yield and uptime.

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Kurtz Ersa's Powerflow Ultra wave soldering machine features a new soldering module that can achieve speeds of up to 5mm/s.

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Kurtz Ersa's Versaflow One X-Series of selective soldering machines offers the option of two pots per soldering module, and can process up to eight assemblies (max. dimensions 350 x 508mm) and up to four assemblies (max. dimensions 508 x 508mm) simultaneously.

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Mek's SpectorBOX X series is a modular full 3-D AOI system for Through-Hole Technology (THT) solder joints and THT components.

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