Indium's CW-807RS halide- and halogen-free flux-cored wire improves wetting speeds and cycle times for electronics assembly and robot soldering applications.

Mycronic's MYPro A40SX and A40LX are the latest additions to its MYPro A40 pick-and-place platform, equipped with new MX7 high-speed mounthead technology.

Unigen's DDR5 family of high-performance memory modules are intended to meet the growing demand for bandwidth, capacity and power efficiency in compute, storage, networking, AI and industrial applications.

Hirose Electric's K.FL2 series of micro RF connectors feature a low profile of 1.2mm when mated.

Vishay Intertechnology's Siliconix SiJK140E 40V MOSFET is said to reduce on-resistance by 32% while offering 58% lower on-resistance than 40V MOSFETs in the TO-263-7L.

Vishay Intertechnology's D2TO35M automotive grade surface-mount thick film power resistor combines multi-pulse capabilities with high power dissipation of 35W at 25°C.

Shenmao's PF606-P lead-free solder paste is designed specifically for the reverse hybrid assembly process, which uses SAC solder paste and BGA components with LTS balls.

Vishay Intertechnology's TS7 single-turn, surface-mount cermet trimmers are designed to work in harsh environments.

Scienscope's Xspection 3120 offline x-ray inspection system is specifically designed for long PCBs.

ULT's ACD 400.1 Ex was developed for the extraction and filtration of dry, flammable and non-flammable gases and vapors in concentrations up to 20% of the lower explosion limit.

Rohm Semiconductor's surface-mount SiC Schottky barrier diodes (SBDs) improve insulation resistance by increasing the creepage distance between terminals.

Specialty Coating Systems PrecisionCure UVC microwave UV curing system now comes in two sizes — 46" and 80".