Viscom SE is set to debut vAI ProVision, showcasing a major advancement in AI-driven inspection automation. As part of Viscom’s vAI platform, this new software feature uses artificial intelligence to automate and optimize the creation of 3D AOI and 3D AXI inspection programs, cutting time from hours to minutes. By embedding AI directly into the vVision Software environment, vAI ProVision enables nearly autonomous program generation, delivering deep inspection coverage, exceptional image quality, and consistent results. 

Vishay Intertechnology has introduced the LTA 50, an AEC-Q200 qualified 50 W thick film power resistor in a compact TO-220 package designed for direct mounting on a heatsink. Engineered for exceptional reliability in harsh automotive environments, the LTA 50 withstands temperatures up to +175 °C, high humidity, vibration and electrical stress. With resistance values from 0.010 Ω to 450 kΩ and tolerances down to ± 1 %, the device is ideal for use as a precharge or discharge resistor in on-board chargers, battery management systems and motor controls for EV, HEV and PHEV applications. RoHS-compliant and non-inductive, the LTA 50 features a dielectric strength of 1500 Vrms and limiting element voltage of 500 V.

Shenmao has introduced PF602-P241M-HS, a low-temperature Sn-Bi solder paste engineered for assembling heat sinks and cold plates in AI server cooling systems. Designed to support advanced thermal management architectures, the paste minimizes warpage by soldering below 200 °C and delivers strong mechanical bonding for low-void joints. Its lead-free, halogen-free formulation ensures wetting on copper, aluminum and Ni-plated surfaces. Compatible with stencil printing and dispensing, PF602-P241M-HS enhances cooling efficiency and thermal reliability in both air- and liquid-cooled server designs. 

Telit Cinterion has announced deviceWISE Intelligence Suite, a platform designed to bring AI-powered autonomous control to the factory floor. The suite enables intelligent agents to autonomously observe, analyze and act across every machine, sensor and workflow. Integrating with PLCs, robots, CNCs and enterprise systems, the platform supports use cases including fault detection, workflow guidance, process insights and real-time information retrieval. It also introduces self-mapping factory capabilities, anomaly detection without manual training, and MCP server/client functionality for multi-agent coordination. The suite will be available in January.

Yincae Advanced Materials has launched UF 66L, a next-generation Optical Clear Underfill (OCU) designed for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules and advanced flip-chip assemblies. Engineered to deliver both high transparency and thermal endurance, UF 66L withstands five reflow cycles at 260 °C without cracking, delamination or adhesion loss. It maintains over 95% light transmittance between 400–800 nm, ensuring minimal signal loss in optical pathways, while its non-yellowing stability preserves clarity even after repeated high-temperature exposure. The material offers excellent adhesion to silicon, glass and substrates. Formulated with a controlled modulus that reinforces delicate structures while minimizing stress and warpage, addressing the limitations of conventional epoxy underfills that degrade under thermal cycling. It is optimized for optical interconnect stability, waveguide coupling, photodetectors and other high-density optoelectronic packaging scenarios.

Yamaha Robotics SMT Section has released an upgraded version of YSUP-PG, its program generator designed to accelerate new product introduction (NPI) for surface-mount lines. Features an enhanced user interface and advanced automation that streamlines data conversion from popular EDA formats such as ODB++, enabling faster generation of mounter and inspection programs. Real-time component-placement image updates, clickable task lists and automated workflows. Enables AOI libraries to be created directly from CAD data, allowing mounter and inspection programs to be developed in parallel. Enhanced Gerber image and CAM conversion tools produce accurate simulated board images, with built-in compositing that automatically calculates PCB layer images. By combining Gerber and CAD data, the software digitally determines push-up pin positions.

Seika Machinery's Nippon Nozzle division supplies precision spinnerets, spunlace jetstrips, film dies and inspection systems to North American manufacturers. Known for machining tolerances down to ±0.001 mm. The product line includes wet, dry, air-gap and melt spinnerets; hydroentanglement jetstrips; tailored film extrusion nozzles; and ultrasonic cleaning and automated measurement systems. All components are produced through in-house alloy melting, precision machining, polishing and inspection to ensure consistent fiber and film flow. 

Solderstar debuts complete vapour phase verification suite. The solution pairs the VP10 Thermal Profiler with the VP Shuttle Verification Fixture, enabling manufacturers to validate both machine performance and board-specific behaviour with precision. The VP10’s low 37 mm profile and 10 measurement channels provide broad thermal coverage, minimising blind spots and reducing profiling runs. Integrated with Solderstar’s SLX datalogger, the system supports vacuum-stage operation and extended processes while maintaining accuracy. The VP Shuttle Fixture further enhances control, testing oven temperature uniformity across 12 strategic points to distinguish between machine variations and PCB-specific characteristics. They form a unified verification system for qualification, calibration and ongoing production checks.

Vishay Intertechnology has introduced the DLA 04051 series of vPolyTan polymer surface-mount chip capacitors, engineered to meet Defense Logistics Agency 04051 specifications for aerospace, military, and space systems. Feature ultra-low ESR down to 25 mΩ, enabling improved performance in power supplies, radars, radios, transponders and energy storage modules. Offers capacitance values ranging from 4.7 μF to 680 μF and voltage ratings from 2.5 V to 63 V. Long-term reliability is validated through 2000 hours of testing at 125 °C, while mechanical performance includes 500 g shock resistance, MIL-STD-202-204 Level D vibration compliance and 10 thermal shock cycles per MIL-STD-202-107. As a second-source alternative to Yageo/Kemet components, the DLA 04051 series provides design assurance and supply chain security for mission-critical AMS applications. Samples and production units are available with 35-week lead times, starting at $1.50 per unit for U.S. deliveries.

Dymax has introduced 9773, a ruggedizing and staking adhesive engineered to secure and protect components on printed circuit boards used in satellites, missiles and other space-based systems. The material is certified to NASA ASTM E595 Low Outgassing and Mil-Std 883 Method 5011 Low Ionic Content standards. Offers on-demand UV/visible light curing, which speeds processing and increases throughput by eliminating delays associated with traditional two-part epoxies. It is non-slumping for up to 72 hours on vertical surfaces and is compatible with jet dispensing, making it well-suited for ruggedizing, staking, or encapsulating PCB components. With a one-part, solvent-free and halogen-free formulation, Dymax 9773 also supports sustainability goals while delivering high performance.

Yamaha Robotics has introduced its latest LM placement head, engineered to extend the capabilities of surface-mount machines to handle today’s larger, heavier, and more complex components. The LM head combines enhanced hardware and software features, including extended R-axis and Z-axis control, high-precision placement-force management up to 100N and advanced landing detection, to support accurate alignment and insertion of bulky components such as high pin-count press-fit connectors. A redesigned gripping section and a new suite of interchangeable nozzles allow secure handling of oversized ICs, DIMM sockets and other non-standard parts, while compatibility with existing nozzles ensures seamless placement of standard SMD, SOP, and QFP devices.

ioTech has unveiled the io600, a high-speed, high-resolution inline digital laser material deposition system engineered to bring Continuous Laser Assisted Deposition (CLAD) into full-scale industrial manufacturing. Capable of depositing up to 7.2 million dots per hour with a 600 x 600 mm active work area, the io600 delivers 50µm resolution and ±10µm positional accuracy for high-volume production. Its nozzle-free, non-contact laser design eliminates clogging and maintenance, enabling continuous operation and lower ownership costs. Supporting a wide range of dielectric and conductive materials, including polymers, solder pastes, conductive inks, metals and ceramics, the io600 enables complex multilayer geometries and seamless scaling from prototyping to mass production.