Kyocera's 159-7X0 series is its first linear card-edge connectors to feature a beryllium copper spring contact system, which is said to deliver high electrical and mechanical reliability, high signal integrity and high durability in harsh environment applications.

Vishay Intertechnology's series of 10MBd high speed optocouplers provides low power consumption to save energy in industrial applications.

Stirri's LT-HF solder paste is said to be the world's first low-temperature halogen-free solder paste with an optical tracer.

ViscoTec's eco-PEN XS 180 volumetric microdispenser precisely dispenses quantities as small as 0.25μL and beads as narrow as 0.1mm, depending on the material.

ASMPT's CMAT-S is an all-in-one system for assembling and dynamically aligning lenses in ADAS cameras.

Renishaw's RenAM 500 Ultra laser powder bed fusion (LPBF) 3-D printer incorporates new scanning algorithms that allow the laser to fire while the recoater is moving, saving up to nine seconds per build layer.

Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.

AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.

Master Bond's UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.

Tagarno's T50 digital microscope is equipped with a 4K/60FPS block camera to provide users with a seamless and lag-free viewing experience.

Nordson Electronics Solutions' Asymtek Select Coat SL-1040 conformal coating system includes system-level advancements to elevate automation, control, precision and preventive maintenance for better yield and uptime.

Kurtz Ersa's Powerflow Ultra wave soldering machine features a new soldering module that can achieve speeds of up to 5mm/s.